Patents by Inventor Szu-Hsien Chen
Szu-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141144Abstract: Disclosed herein is a hydrogel composition that includes a crosslinked collagen polymer, a carboxymethyl cellulose derivative, an aqueous sodium chloride solution, a humectant, and an antimicrobial agent. The crosslinked collagen polymer has collagen, a hydrophilic polyether, and a dicarbamate group linking the collagen to the hydrophilic polyether. The carboxymethyl cellulose derivative is selected from the group consisting of carboxymethyl cellulose, an alkali metal salt of carboxymethyl cellulose, an ammonium salt of carboxymethyl cellulose, and combinations thereof. The humectant is selected from the group consisting of glycerin, propylene glycol, and a combination thereof. The antimicrobial agent is a combination of glycine betaine and polyhexamethylene biguanide hydrochloride.Type: ApplicationFiled: April 17, 2023Publication date: May 2, 2024Inventors: Szu-Hsien CHEN, Chiu-Fang CHEN, Ya-Wen KU, Ren-Shian WANG
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Patent number: 11970569Abstract: Disclosed herein is a polyurethane foam sponge produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing a hydrophilic diisocyanate obtained by reacting a diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a prepolymer which includes 3 to 6 isocyanate groups, and d) mixing the prepolymer with a hydrophilic polyether polyol, a blowing agent, an end-capping agent, a reinforcing agent, and a catalyst to obtain the polyurethane foam sponge. A wound dressing including the polyurethane foam sponge is also disclosed.Type: GrantFiled: September 15, 2020Date of Patent: April 30, 2024Assignee: Tronjen Medical Technology Inc.Inventors: Szu-Hsien Chen, Ya-Wen Ku, Ren-Shian Wang, Chiu-Fang Chen
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Patent number: 11955245Abstract: A method and a system for mental index prediction are provided. The method includes the following steps. A plurality of images of a subject person are obtained. A plurality of emotion tags of the subject person in the images are analyzed. A plurality of integrated emotion tags in a plurality of predetermined time periods are calculated according to the emotion tags respectively corresponding to the images. A plurality of preferred features are determined according to the integrated emotion tags. A mental index prediction model is established according to the preferred features to predict a mental index according to the emotional index prediction model.Type: GrantFiled: July 2, 2021Date of Patent: April 9, 2024Assignees: Acer Incorporated, National Yang Ming Chiao Tung UniversityInventors: Chun-Hsien Li, Szu-Chieh Wang, Andy Ho, Liang-Kung Chen, Jun-Hong Chen, Li-Ning Peng, Tsung-Han Yang, Yun-Hsuan Chan, Tsung-Hsien Tsai
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Patent number: 11571491Abstract: Disclosed herein is a hydrogel wound dressing produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing an hydrophilic diisocyanate obtained by reacting a second diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a first prepolymer which includes 3 to 6 isocyanate groups, d) partially crosslinking the first prepolymer using a crosslinking agent to obtain a second prepolymer, and e) subjecting the second prepolymer to an end-capping reaction with a silane-containing compound to obtain the hydrogel wound dressing.Type: GrantFiled: October 18, 2019Date of Patent: February 7, 2023Assignee: TRONJEN MEDICAL TECHNOLOGY INC.Inventors: Hung-Kai Hsiao, Szu-Hsien Chen, Ya-Wen Ku, Ren-Shian Wang, Chiu-Fang Chen
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Publication number: 20230035312Abstract: A liquid dressing includes a solvent and a film-forming polymer that is dissolved in the solvent and that is made by a process including: providing an alkoxy group-containing silicone resin which is obtained by subjecting an orthosilicate compound and an acidic aqueous solution to a hydrolysis and polymerization reaction; providing an isocyanate group-containing prepolymer which is obtained by reacting a diisocyanate compound with a hydrophilic polyether diol; and subjecting the alkoxy group-containing silicone resin and the isocyanate group-containing prepolymer to a polymerization reaction so as to obtain the film-forming polymer.Type: ApplicationFiled: March 10, 2022Publication date: February 2, 2023Inventors: Szu-Hsien CHEN, Ren-Shian WANG, Ya-Wen KU, Chiu-Fang CHEN
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Patent number: 11239125Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.Type: GrantFiled: December 26, 2018Date of Patent: February 1, 2022Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Hsien-Lung Hsiao, Yu-Cheng Pai, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang
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Publication number: 20210395438Abstract: Disclosed herein is a polyurethane foam sponge produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing a hydrophilic diisocyanate obtained by reacting a diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a prepolymer which includes 3 to 6 isocyanate groups, and d) mixing the prepolymer with a hydrophilic polyether polyol, a blowing agent, an end-capping agent, a reinforcing agent, and a catalyst to obtain the polyurethane foam sponge. A wound dressing including the polyurethane foam sponge is also disclosed.Type: ApplicationFiled: September 15, 2020Publication date: December 23, 2021Inventors: Szu-Hsien Chen, Ya-Wen Ku, Ren-Shian Wang, Chiu-Fang Chen
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Publication number: 20210023814Abstract: A pressure relief cushion includes an elastic layer which is made from a viscoelastic foam material, an adhesive carrying layer disposed on the elastic layer and including an adhesive portion and a carrier portion for carrying the adhesive portion, a hydrogel layer disposed on the adhesive carrying layer opposite to the elastic layer, and a detachable film disposed on the hydrogel layer opposite to the adhesive carrying layer.Type: ApplicationFiled: July 20, 2020Publication date: January 28, 2021Inventors: Szu-Hsien CHEN, Ya-Wen KU, Ren-Shian WANG, Chiu-Fang CHEN
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Publication number: 20210023256Abstract: Disclosed herein is a hydrogel wound dressing produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing an hydrophilic diisocyanate obtained by reacting a second diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a first prepolymer which includes 3 to 6 isocyanate groups, d) partially crosslinking the first prepolymer using a crosslinking agent to obtain a second prepolymer, and e) subjecting the second prepolymer to an end-capping reaction with a silane-containing compound to obtain the hydrogel wound dressing.Type: ApplicationFiled: October 18, 2019Publication date: January 28, 2021Inventors: Hung-Kai Hsiao, Szu-Hsien Chen, Ya-Wen Ku, Ren-Shian Wang, Chiu-Fang Chen
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Publication number: 20200328142Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.Type: ApplicationFiled: August 12, 2019Publication date: October 15, 2020Inventors: Don-Son Jiang, Nai-Hao Kao, Chih-Sheng Lin, Szu-Hsien Chen, Chih-Yuan Shih, Chia-Cheng Chen, Yu-Cheng Pai, Hsuan-Hao Mi
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Publication number: 20200035573Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.Type: ApplicationFiled: December 26, 2018Publication date: January 30, 2020Inventors: Hsien-Lung Hsiao, Yu-Cheng Pai, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang
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Publication number: 20030147016Abstract: The invention has modified the conventional LCD structure, wherein a polarizing film is directly coated in the liquid crystal cell instead of the conventional polarizing plate, which is glued on the outer side of the liquid crystal cell. Then, the invention can prevent the direct contact between the polarizing film and the touch panel of film film (FF) type or in film plastic (FP) type. Thus, the touch panel on the LCD panel can adapt various technologies, so that the touch panel of FF type can be used without worrying about the damage on the polarizing film due to the pressure while a point touch is applied on the touch panel. Also and, for the touch panel of FP type, a conductive film can be directly coated on the panel substrate. The invention uses the coating polarizing film as an extraordinary mode (e-mode) polarizer. Also and, an ordinary mode (o-mode) polarizer can also be adapted, so as to expand the large viewing angle in good polarizing effect.Type: ApplicationFiled: December 9, 2002Publication date: August 7, 2003Inventors: Jacob W. Lin, Chiafu Jeff Nien, Ching-Sheng Cho, Szu-Hsien Chen, Wen-Chi Huang