Abstract: A method for performing cooperative counting and an associated apparatus are provided, where the method is applicable to a counter system, and the counter system includes a plurality of cameras. The method includes: setting a plurality of points on an electronic map as a plurality of predetermined points according to user inputs; determining at least one rule related to the predetermined points according to rule information, where the rule information is stored in the counter system; respectively performing video object detection upon a plurality of images captured by the cameras to generate detection results respectively corresponding to the cameras; and merging the detection results respectively corresponding to the cameras, to count events complying with the at least one rule.

Abstract: A method for performing cooperative counting and an associated apparatus are provided, where the method is applicable to a counter system, and the counter system includes a plurality of cameras. The method includes: setting a plurality of points on an electronic map as a plurality of predetermined points according to user inputs; determining at least one rule related to the predetermined points according to rule information, where the rule information is stored in the counter system; respectively performing video object detection upon a plurality of images captured by the cameras to generate detection results respectively corresponding to the cameras; and merging the detection results respectively corresponding to the cameras, to count events complying with the at least one rule.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body has a specified side including a first portion, a second portion and an indentation. The second portion is higher than the first portion. The indentation is formed in the first portion and the second portion. The latching mechanism has an end fixed onto the second portion and extended above a bottom surface of the indentation, wherein the latching mechanism includes at least a fastening part.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body has a specified side including a first portion, a second portion and an indentation. The second portion is higher than the first portion. The indentation is formed in the first portion and the second portion. The latching mechanism has an end fixed onto the second portion and extended above a bottom surface of the indentation, wherein the latching mechanism includes at least a fastening part.

Abstract: A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The power input device is coupled to an input terminal of the main body. The first power output device includes a first cable and a first connector. The first cable is interconnected between a first output terminal of the main body and a first surface of the first connector. An extension part is extended from the first surface of the first connector. The second power output device includes a second cable and a second connector. A first surface of the second connector is suppressed by the extension part of the first connector to facilitate securely fixing the first connector and the second connector in a power socket, so that a regulated output voltage is outputted from the first and second output devices to the power socket.

Abstract: A semiconductor package assembly having reduced stresses and a method for forming the same are provided. The method includes providing a package substrate comprising a base material, forming an interconnect structure overlying the package substrate, attaching at least one chip to a first surface of the package substrate, thinning the package substrate from a second surface opposite the first surface wherein the semiconductor material is substantially removed, and attaching ball grid array (BGA) balls to deep vias exposed on the second surface of the package substrate after thinning the package substrate.

Abstract: A method includes joining an integrated circuit die having at least one low-k dielectric layer to a package substrate or printed circuit board using a plurality of solder bumps located between the die and the package substrate or printed circuit board. The low-k dielectric layer has a dielectric constant of about 3.0 or less. The solder bumps have a lead concentration of about 5% or less. A stratified underfill is formed between the die and the package substrate or printed circuit board.

Abstract: A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.

Abstract: A method and system is disclosed for better packaging semiconductor devices. In one example, a semiconductor device package comprises a package substrate, at least one die with an orientation of <100> placed on the substrate with electrical connections made between the package substrate and the die, and an underfill fillet attaching the die to the substrate with the underfill fillet reaching less than 60% of a thickness of the die on at least one side thereof.

Abstract: A method of cutting an integrated circuit chip from a wafer having a plurality of integrated circuit chips is provided. An upper portion of the wafer is ablated using two laser beams to form two substantially parallel trenches that extend into the wafer from a top surface of the wafer through intermetal dielectric layers and at least partially into a substrate of the wafer. After the ablating to form the two trenches, cutting through the wafer between outer sidewalls of the two laser-ablated trenches with a saw blade is performed. A width between the outer sidewalls of the two laser-ablated trenches is greater than a cutting width of the saw blade. This may be particularly useful in lead-free packaging applications and/or applications where the intermetal dielectric layers use low-k dielectric materials, for example.

Abstract: A combination structure of a socket and a container is provided. The combination structure includes a container having an opening, and a socket includes a connecting section for being engaged with the opening, a first end extended from the connecting section for being electrically connected to an electronic equipment which is positioned outside the container, and a second end extended from the connecting section for electrically connecting to a circuit unit which is positioned inside the container, wherein a cross-section of the second end is greater than that of the opening and the cross-section of the opening is greater than that of the first end so that the first end is passed through the opening from an inside of the container and exposed to an outside of the container, and the opening blocks the second end for avoiding the second end passing therethrough and fixing the socket inside the container besides mutually fixing the connecting section.

Abstract: A combination structure of a socket and a container is provided. The combination structure includes a container having an opening, and a socket includes a connecting section for being engaged with the opening, a first end extended from the connecting section for being electrically connected to an electronic equipment which is positioned outside the container, and a second end extended from the connecting section for electrically connecting to a circuit unit which is positioned inside the container, wherein a cross-section of the second end is greater than that of the opening and the cross-section of the opening is greater than that of the first end so that the first end is passed through the opening from an inside of the container and exposed to an outside of the container, and the opening blocks the second end for avoiding the second end passing therethrough and fixing the socket inside the container besides mutually fixing the connecting section.

Abstract: A guiding device is provided for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board. The guiding device includes a base for supporting and fixing the conducting wire thereon, a first offset board connected to one end of the base for forming a space with an extending portion of the conducting wire when the conducting wire is fixed on the base and a second offset board connected to the other end of the base, which has a hole in a connection portion thereof for preventing the heat from being conducted to the printed circuit board when the conducting wire is soldered on the printed circuit board.

Abstract: A connector having a relatively high terminal density is provide for reducing the requirement of the electric currents in one signal terminal and increase the conducting efficiency. The connector includes plural first conducting components each having a first terminal and extended laterally, plural second conducting components each having at least two second terminals and extended laterally, and an insulating housing having plural slots for mounting the plural first conducting components and the plural second conducting components, wherein each first conducting component and each corresponding second conducting component are mounted in the respective slot, so as to contain a contact pad having plural pins.

Abstract: The present invention discloses power supply cable for providing DC power from a power supply to a microprocessor of a personal computer. The output cable includes a plate-cable includes a first and a second metal plates insulated with an insulation layer between the first and second metal plates. The output cable further includes a plurality of capacitors disposed on the plate cable. Each of the capacitors has a first and second electrical terminals and each of the first and second electrical terminals connected to one of the first and second metal layers provided for storing electrical charges therein for transmitting through the metal layers for supplying power to the microprocessor. In a preferred embodiment, the plurality of capacitors disposed on the first metal plate with the first electrical terminal for each of the capacitors connected to the first metal plate.

Abstract: A guiding device is provided for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board. The guiding device includes a base for supporting and fixing the conducting wire thereon, a first offset board connected to one end of the base for forming a space with an extending portion of the conducting wire when the conducting wire is fixed on the base and a second offset board connected to the other end of the base, which has a hole in a connection portion thereof for preventing the heat from being conducted to the printed circuit board when the conducting wire is soldered on the printed circuit board.

Abstract: The present invention discloses a direct-current (DC) electric connector that includes plurality of conductive and insulation layers constituting a near-zero inductance connector. The connector further includes a top and a bottom insulation-and-protection covers covering and protecting the plurality of conductive and insulation layers. The top and bottom insulation-and-protection covers having a tapered outer surface for providing a tapered profile along a horizontal direction toward a connector opening for receiving a printed circuit board into the near-zero inductance connector. The connector further includes a locking cartridge for adaptively enclosing the near-zero inductance connector with the printed circuit board inserted therein. The locking cartridge has top and bottom surfaces each engages the top and bottom insulation-and-protection covers respectively for horizontally pushing toward a direction having a gradually increased profile height for generating a vertical pressing force.