Abstract: The present invention discloses an apparatus and a method for manufacturing molding inductor. The apparatus mainly comprises a mold and at least one magnetic force generating unit. Particularly, the mold is designed to have one or more accommodation spaces to correspondingly receive one or more coils. On the other hand, the magnetic force generating unit is configured to apply a magnetic force to the accommodation spaces after a molding material doped with magnetic ferrite powder is filled into the accommodation spaces receiving with the coil therein. Consequently, the molding material is forced by a molding stress provided by the applied magnetic force to move effectively downward in the accommodation space, such that a molded body is eventually formed in the accommodation space.

Abstract: The present invention discloses an apparatus and a method for manufacturing molding inductor. The apparatus mainly comprises a mold and at least one magnetic force generating unit. Particularly, the mold is designed to have one or more accommodation spaces to correspondingly receive one or more coils. On the other hand, the magnetic force generating unit is configured to apply a magnetic force to the accommodation spaces after a molding material doped with magnetic ferrite powder is filled into the accommodation spaces receiving with the coil therein. Consequently, the molding material is forced by a molding stress provided by the applied magnetic force to move effectively downward in the accommodation space, such that a molded body is eventually formed in the accommodation space.

Abstract: A multi-layered ceramic electronic device is made by attaching respective inner bonding surfaces of two lead frames to two opposite electrode junctions of a multi-layered ceramic chip in such a manner that a predetermined buffer space is defined between respective bottom bonding portions of the lead frames and the bottom side of the multi-layered ceramic chip, and then applying a conductive polymer adhesive to bond the inner bonding surfaces of the lead frames to the electrode junctions of the multi-layered ceramic chip at a predetermined low bonding temperature and to electrically conduct the leaf frames to the electrode junctions of the multi-layered ceramic chip.

Abstract: An overvoltage protection device made by: employing a machining technique to make a through hole through opposing top and bottom walls of a substrate, and then filling an overvoltage protection material in the through hole of the substrate, and then curing the overvoltage protection material, and then coating a flat electrode on each of the top and bottom walls of the substrate over and in connection with top and bottom sides of the overvoltage protection material.

Abstract: An overvoltage protection device made by: employing a machining technique to make a through hole through opposing top and bottom walls of a substrate, and then filling an overvoltage protection material in the through hole of the substrate, and then curing the overvoltage protection material, and then coating a flat electrode on each of the top and bottom walls of the substrate over and in connection with top and bottom sides of the overvoltage protection material.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.