Patents by Inventor Szu-Wei Lin

Szu-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955459
    Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11946300
    Abstract: A lever-operated latch device includes an assembly of a case body, an actuation body mounted on the case body, a linking member and a slide body. The actuation body has a free end and a pivoted end pivotally connected with the case body in cooperation with elastic members. The free end of the actuation body is formed with two protruding arms and an opening section positioned between the protruding arms. An operation section is disposed in the opening section. The linking member has a first end pivotally connected with the free end of the actuation body (or the operation section) and a second end connected with the slide body. When an operator presses the operation section, the actuation body is permitted to move from a closed position to an opened position so as to drive the linking member and the slide body to move.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Fositek Corporation
    Inventors: An Szu Hsu, Chun Han Lin, Che Wei Chang
  • Patent number: 11948896
    Abstract: A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure, wherein the first stacked die package structure comprises a plurality of memory dies. The underfill layer is over the first stacked die package structure. the package layer is over the underfill layer, wherein the package layer has a protruding portion that extends below a top surface of the through substrate via structure.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu
  • Patent number: 11922887
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated thin-film transistors. The diode may be coupled to drive transistor circuitry, a data loading transistor, and emission transistors. The drive transistor circuitry may include at least two transistor portions connected in series. The data loading transistor has a drain region connected to a data line and a source region connected directly to the drive transistor circuitry. The data line may be connected to and overlap the drain region of the data loading transistor. The data line and the source region of the data loading transistor are non-overlapping to reduce row-to-row crosstalk.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Shinya Ono, Chin-Wei Lin, Chuan-Jung Lin, Gihoon Choo, Hassan Edrees, Hei Kam, Jung Yen Huang, Pei-En Chang, Rungrot Kitsomboonloha, Szu-Hsien Lee, Zino Lee
  • Publication number: 20150317032
    Abstract: A method for performing touch communications control and an associated apparatus are provided, where the method includes the steps of: performing communications to establish at least one communications connection between the touch communications device and a plurality of touch communications devices; obtaining identification information of each touch communications device of the plurality of touch communications devices to determine whether each touch communications device of the plurality of touch communications devices is one of a plurality of predetermined touch communications devices; and performing a predetermined action based on whether each touch communications device of the plurality of touch communications devices is one of the plurality of predetermined touch communications devices.
    Type: Application
    Filed: November 14, 2014
    Publication date: November 5, 2015
    Inventors: Szu-Wei Lin, Tzu-Wen Chang, Wan-Chun Liao, Shang-Lun Ting, Jing-Kuang Huang
  • Publication number: 20150173116
    Abstract: A communications system, device and method are provided. The communication device includes a communication unit, configured to establish a link with a second communication device by a touch-link technology; a sensing unit, configured to generate a sensing result by sensing the communication device; and a processing unit, configured to determine a role for the communication device according to the sensing result.
    Type: Application
    Filed: August 20, 2014
    Publication date: June 18, 2015
    Inventors: Tsung-Yueh CHIANG, Szu-Wei LIN
  • Publication number: 20040108384
    Abstract: An image data transfer device for use with a portable non-volatile memory card and an optical disc includes a memory card socket for attaching thereto the portable non-volatile memory card; a digital image processor electrically connected to the portable non-volatile memory card which has been attached to the memory card socket, reading a digital image data from the portable non-volatile memory card, and transforming the digital image data into an interactive image file; and a recording device electrically connected to the digital image processor for writing the interactive image file into the optical disc which has been placed into the recording device.
    Type: Application
    Filed: March 26, 2003
    Publication date: June 10, 2004
    Inventors: John C. Wang, Yung-Chieh Lin, Szu-Wei Lin