Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are presented. In embodiments the methods of manufacturing include depositing a first bonding layer on a first substrate, wherein the first substrate comprises a semiconductor substrate and a metallization layer. The first bonding layer and the semiconductor substrate are patterned to form first openings. A second substrate is bonded to the first substrate. After the bonding the second substrate, the second substrate is patterned to form second openings, at least one of the second openings exposing at least one of the first openings. After the patterning the second substrate, a third substrate is bonded to the second substrate, and after the bonding the third substrate, the third substrate is patterned to form third openings, at least one of the third openings exposing at least one of the second openings.

Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.

Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.

Abstract: An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.

Abstract: A device and a method for generating floating images are provided. An optical imaging module generates a first floating image. A sensing module sends a detection signal to sense first position information of a tested object at a first time point, and generates a feedback signal according to the first position information when the first position information is within a contour range of the first floating image. A signal processing module is electrically connected to the optical imaging module and the sensing module to receive the feedback signal and generate at least one control command and/or at least one feedback command corresponding to the feedback signal. The at least one control command is transmitted to a controller to perform corresponding control on the controller, and the at least one feedback command is transmitted to the optical imaging module, so that the optical imaging module generates a second floating image different from the first floating image.

Abstract: A device and a method for generating floating images are provided. An optical imaging module generates a first floating image. A sensing module sends a detection signal to sense first position information of a tested object at a first time point, and generates a feedback signal according to the first position information when the first position information is within a contour range of the first floating image. A signal processing module is electrically connected to the optical imaging module and the sensing module to receive the feedback signal and generate at least one control command and/or at least one feedback command corresponding to the feedback signal. The at least one control command is transmitted to a controller to perform corresponding control on the controller, and the at least one feedback command is transmitted to the optical imaging module, so that the optical imaging module generates a second floating image different from the first floating image.