Abstract: A semiconductor device includes a bottom semiconductor die including a bottom semiconductor die sidewall, a top semiconductor die bonded to the bottom semiconductor die and including a top semiconductor die sidewall, and a molding material layer formed on an upper surface of the bottom semiconductor die, on the top semiconductor die sidewall, and on the bottom semiconductor die sidewall. A method of forming a semiconductor device includes mounting a bottom semiconductor die including a bottom semiconductor die sidewall on a carrier substrate, mounting a top semiconductor die including a top semiconductor die sidewall on the bottom semiconductor die, and forming a molding material layer on an upper surface of the bottom semiconductor die, on the top semiconductor die sidewall, and on the bottom semiconductor die sidewall.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A package structure and a formation method are provided. The method includes providing a semiconductor substrate and bonding a first chip structure on the semiconductor substrate through metal-to-metal bonding and dielectric-to-dielectric bonding. The method also includes bonding a second chip structure over the semiconductor substrate through solder-containing bonding structures. The method further includes forming a protective layer surrounding the second chip structure. A portion of the protective layer is between the semiconductor substrate and a bottom of the second chip structure.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The substrate is singulated to form dies. The first side of the dies are attached to a carrier. The dies are thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the dies. A device die is bonded to the second connectors. The dies and device dies are singulated into multiple packages.

Abstract: An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.

Abstract: An inner circulation ball screw includes a screw shaft, a nut, and a return member. The nut is disposed on the screw shaft to form a load path with the screw shaft. The return member is disposed in an accessory slot of the nut to form a non-load path connected with the load path to form a circulation path for circulation of balls. The return member has a ball-discharging channel provided with one end connected with an ineffective thread section of the nut and the other end communicating with a ball-discharging hole of the nut. Therefore, the balls are allowed to move to the outside of the nut through the ball-discharging channel and the ball-discharging hole for preventing the balls from being stuck in the ineffective thread section, thereby solving the problems of high resistance and damaging to related accessories.

Abstract: A linear transmission device includes a screw, a moving member, a return element, and a sensor. The moving member is set in the screw to form a load path therebetween. The return element is set in the moving member and has a return path connected to the load path. The return path and the load path constitute a circulating path for balls to run. The moving member has an internal thread with an ineffective thread section. The moving member has a receiving groove adjacent to the ineffective thread section. The sensor is embedded in the receiving groove of the moving member without affecting the operation of the balls. Thus, the linear transmission device of the present invention can solve the problem of the sensor protruding from the moving member, so that the configuration of the surrounding space and the stroke of the moving member will not be affected.

Abstract: A linear transmission device includes a screw, a moving member, a return element, and a sensor. The moving member is set in the screw to form a load path therebetween. The return element is set in the moving member and has a return path connected to the load path. The return path and the load path constitute a circulating path for balls to run. The moving member has an internal thread with an ineffective thread section. The moving member has a receiving groove adjacent to the ineffective thread section. The sensor is embedded in the receiving groove of the moving member without affecting the operation of the balls. Thus, the linear transmission device of the present invention can solve the problem of the sensor protruding from the moving member, so that the configuration of the surrounding space and the stroke of the moving member will not be affected.

Abstract: A linear actuator and an identification method thereof are characterized in that a memory unit of the embedding device stores the parameter data of the linear actuator, such as the parameters and the axial position of the elongated shaft, and the microprocessor determines whether the sensing device is activated, and through the process of parameter analysis, data transmission, and algorithm calculation, the calculation control device performs an instantaneous calculation to determine the state of the linear actuator, thereby improving the disadvantage of a single function of the conventional technology, avoiding the problem that the unidentified linear actuator causes the abnormality of the sensing device, and effectively finding the problem of abnormal function of the linear actuator.

Abstract: A linear actuator and an identification method thereof are characterized in that a memory unit of the embedding device stores the parameter data of the linear actuator, such as the parameters and the axial position of the elongated shaft, and the microprocessor determines whether the sensing device is activated, and through the process of parameter analysis, data transmission, and algorithm calculation, the calculation control device performs an instantaneous calculation to determine the state of the linear actuator, thereby improving the disadvantage of a single function of the conventional technology, avoiding the problem that the unidentified linear actuator causes the abnormality of the sensing device, and effectively finding the problem of abnormal function of the linear actuator.

Abstract: A dustproof device is provided for use with a ball screw which includes a screw rod and a nut mounted around the screw rod. The dustproof device includes an annular body and an elastic valve plate. The annular body is disposed inside the nut and penetrated by the screw rod and has an outer annular surface provided with a debris exit. The debris exit has one end in communication with a spiral passage formed between the screw rod and the nut. The elastic valve plate, which is provided at the opposite end of the debris exit of the annular body, can be pushed open by a fluid and thus opens the debris exit, allowing the debris generated by the ball screw to be discharged through the debris exit along with the fluid, thereby contributing to extending the service life of the ball screw.

Abstract: A split detection device includes: a detection unit, which includes a detection casing and a sensor that is mounted inside the detection casing; a processing unit, which includes a processing casing and a processor that is mounted inside the processing casing; a connection unit, which is electrically connected between the sensor of the detection unit and the processor of the processing unit; and a transmission unit, which is electrically connected between the processor of the processing unit and an external device. By setting up the sensor and the processor inside different casings to be separate from each other, influence of the processor on the sensor can be reduced to thereby improve accuracy of detection.

Abstract: A split detection device includes: a detection unit, which includes a detection casing and a sensor that is mounted inside the detection casing; a processing unit, which includes a processing casing and a processor that is mounted inside the processing casing; a connection unit, which is electrically connected between the sensor of the detection unit and the processor of the processing unit; and a transmission unit, which is electrically connected between the processor of the processing unit and an external device. By setting up the sensor and the processor inside different casings to be separate from each other, influence of the processor on the sensor can be reduced to thereby improve accuracy of detection.

Abstract: A sensor assembly includes: a base with an installation space; an electrical connection member disposed on the base; a sensing unit including at least two physical sensors and one integrated circuit board; and a contact member disposed at one end of the base. The sensor assembly is a combination of the temperature sensor and the vibration sensor, the main physical parameters (including back clearance, collision, thermal displacement and lubrication) regarding the operation of the linear motion transmission device can be calculated based on the temperature signal and vibration signals, without requiring the installation of separate different sensors. Therefore, installation space is reduced. The sensor assembly is directly abutted against the linear motion transmission device to detect the change of various physical values in a most direct manner.

Abstract: A ball screw with a support device includes: a screw; a nut unit movably mounted on the screw; a support device including: a first support seat and a second support seat which are movably mounted on the screw and located at two sides of the nut unit; and a speed control device capable of presetting a speed of the nut unit and the first and second support seats, wherein the speed of the nut unit is VNT, the speed of the first and second support seats is VSUP, and they satisfy the relation: 0<VSUP/VNT<½. When the two ends of the screw are used as a fixing end and a support end, respectively, the ball screw can have an optimized critical rotation speed, which consequently improves the work efficiency of the ball screw.

Abstract: A dustproof device is provided for use with a ball screw which includes a screw rod and a nut mounted around the screw rod. The dustproof device includes an annular body and an elastic valve plate. The annular body is disposed inside the nut and penetrated by the screw rod and has an outer annular surface provided with a debris exit. The debris exit has one end in communication with a spiral passage formed between the screw rod and the nut. The elastic valve plate, which is provided at the opposite end of the debris exit of the annular body, can be pushed open by a fluid and thus opens the debris exit, allowing the debris generated by the ball screw to be discharged through the debris exit along with the fluid, thereby contributing to extending the service life of the ball screw.

Abstract: A dustproof device is provided for use with a ball screw which includes a screw rod and a nut mounted around the screw rod. The dustproof device includes an annular body and an elastic valve plate. The annular body is provided at one end of the nut and penetrated by the screw rod and has an outer annular surface provided with a debris exit. The debris exit has one end in communication with a spiral passage formed between the screw rod and the nut. The elastic valve plate, which is provided at the opposite end of the debris exit of the annular body, can be pushed open by a fluid and thus opens the debris exit, allowing the debris generated by the ball screw to be discharged through the debris exit along with the fluid, thereby contributing to extending the service life of the ball screw.

Abstract: A sensor assembly includes: a base with an installation space; an electrical connection member disposed on the base; a sensing unit including at least two physical sensors and one integrated circuit board; and a contact member disposed at one end of the base. The sensor assembly is a combination of the temperature sensor and the vibration sensor, the main physical parameters (including back clearance, collision, thermal displacement and lubrication) regarding the operation of the linear motion transmission device can be calculated based on the temperature signal and vibration signals, without requiring the installation of separate different sensors. Therefore, installation space is reduced. The sensor assembly is directly abutted against the linear motion transmission device to detect the change of various physical values in a most direct manner.

Abstract: A motion guide device includes a movable member attached onto an elongated member for forming a ball guiding passage and for receiving ball bearing members between the elongated member and the movable member, a detecting device includes a magnetic member and an insulated tube engaged into a hole of the movable member, and a warning device is coupled between the movable member and the magnetic member for generating a warning signal when the movable member and the magnetic member are electrically connected together with worn particles and for allowing the user to examine and to repair the motion guide device or the ball screw device when required.