Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.

Abstract: This invention relates to a process and a device of high voltage test with detecting function for short or open circuits comprises carying out test of short or open circuits with low voltage for an object prior to a high voltage test, checking forrner step properly and then carrying out high voltage test to improve the life time of devices and test points, which also can improve the reliability of test.