Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. The through hole corresponds to the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. The fan corresponds to the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

Abstract: A notebook computer includes a base, a first display device, a second display device and a camera. A first side of the first display device is pivotally connected to the base and the second display device is pivotally connected to a second side of the first display device, wherein the first side is opposite to the second side. The camera is disposed on the second display device. The second display device rotates with respect to the first display device to adjust an angle and a height of the camera.

Abstract: A method of light compensating for a computer system includes utilizing a camera of the computer system to capture a profile of a user to establish a user identity; receiving a setting signal, wherein the setting signal is used for setting an environment configuration of a display device of the computer system; and controlling the display device to compensate lights according to a plurality of first modes, a plurality of second modes and the environment configuration when the user utilizes the video camera to capture images; wherein the plurality of first modes are related to a plurality of video events created by the user, and the plurality of second modes are generated according to adjustments and setups made by the user for the plurality of first modes during each light compensating process.

Abstract: A method for accumulating and sharing beads rotation data with the method adapted to a bead string communicatively connecting to a communication device, and with the method comprises: generating a measurement signal by the bead string; receiving the measurement signal by a communication unit of the communication device; determining whether the measurement signal conforms to an accumulation amount by a computing unit of the communication device; and generating the beads rotation data and displaying the beads rotation data by a displaying unit of the communication device, wherein the beads rotation data comprises a number of beads rotations or a time of beads rotation.

Abstract: A method for accumulating and sharing beads rotation data with the method adapted to a bead string communicatively connecting to a communication device, and with the method comprises: generating a measurement signal by the bead string; receiving the measurement signal by a communication unit of the communication device; determining whether the measurement signal conforms to an accumulation amount by a computing unit of the communication device; and generating the beads rotation data and displaying the beads rotation data by a displaying unit of the communication device, wherein the beads rotation data comprises a number of beads rotations or a time of beads rotation.

Abstract: A method of calibrating an impedance-matching current sensor (IMCS) is provided. The IMCS has an equivalent sensing impedance and is connected in parallel to an object under test. The method includes steps of: using an alternating-current (AC) current source to provide a first AC current flowing through the object under test and provide a second AC current flowing through the IMCS; designing the equivalent sensing impedance to make the first AC current much greater than the second AC current; proportionally converting the second AC current into a sense voltage; and adjusting a magnitude of the sense voltage to be proportional to a magnitude of the first AC current. Accordingly, it is to significantly overcome problems of unreliability and instability of the DC-to-DC conversion system caused by temperature, aging, DC bias variation, or parasitic effect, thus maintaining correct sensed results of the current sensor in transient response optimization.

Abstract: A method of calibrating an impedance-matching current sensor (IMCS) is provided. The IMCS has an equivalent sensing impedance and is connected in parallel to an object under test. The method includes steps of: using an alternating-current (AC) current source to provide a first AC current flowing through the object under test and provide a second AC current flowing through the IMCS; designing the equivalent sensing impedance to make the first AC current much greater than the second AC current; proportionally converting the second AC current into a sense voltage; and adjusting a magnitude of the sense voltage to be proportional to a magnitude of the first AC current. Accordingly, it is to significantly overcome problems of unreliability and instability of the DC-to-DC conversion system caused by temperature, aging, DC bias variation, or parasitic effect, thus maintaining correct sensed results of the current sensor in transient response optimization.

Abstract: A buck converter includes a power stage circuit and a control circuit. The power stage circuit has a pair of switches, an output inductor, and an output capacitor. The control circuit has a current-sensing unit (CCS), an error-amplifying (EA) and transient-holding (TH) unit, a transient-optimized feedback unit (TOF), and a PWM generation unit. The CCS senses an output capacitor current. The EA with the TH receives a feedback voltage and a reference voltage to generate an error signal. The TOF receives the feedback voltage and the reference voltage to generate a proportional voltage signal by a variable gain value. The PWM generation unit receives the proportional voltage signal and a sensing voltage signal to generate a PWM signal. When the proportional voltage signal equals the sensing voltage signal, the switches are controlled by the PWM signal at an optimal time point so that transient responses are optimized.