Abstract: An electronic device and a method for manufacturing the same are disclosed. The electronic device of the present disclosure comprises: a target unit comprising an electronic unit layer; and small molecule residues adhered on a side of the target unit, wherein the small molecule residues are at least one selected from the group consisting of and R1, R1?, R2, R2?, R3, R3?, R4, R5, R6, R7, R8 are defined in the specification.

Abstract: A semiconductor packaging structure comprises a die; at least one pad on the die; a least one elastomers on a corresponding one of the at least one pad, wherein the at least one elastomer is made of conductive or non-conductive material; a first conductor on the elastomer; a second conductor located on the first conductor. The second conductor is directly welded to a substrate. Thermal expansion between the substrate and the die is absorbed by the strain of the elastomer and the extension of the first conductor. Furthermore, a method for forming the semiconductor packaging structure is disclosed.