Abstract: A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.

Abstract: A thermal conductive medium cover is covered on the bottom of a heat sink for protecting a thermal conductive medium on the bottom of the heat sink, and is latched by a latching member for the heat sink. The thermal conductive medium cover includes a tray body covered on the bottom of the heat sink for protecting the thermal conductive medium, and two latched portions formed on two opposite lateral edges of the tray body. Two ends of the latching member respectively latch the two latched portions, so as to fix the tray body to the bottom of the heat sink. Thus, the thermal conductive medium cover is firmly fixed and will not fall off. Meanwhile, the latching member is also fixed and will not shake relative to the heat sink, thus preventing the latching member from colliding with the heat sink.