Abstract: Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.

Abstract: An optical lens assembly is adapted for receiving a light beam that is emitted by an object, and includes a lens unit and a sleeve unit. The lens unit includes a casing that has a light-incident side adapted for receiving the light beam. The sleeve unit surrounds the light-incident side of the casing, and defines a light-receiving space that is adapted for the light beam to pass through so that propagation of the light beam is unaffected by disturbance caused by movement of air. An optical measurement method includes steps of: a) providing a lens unit, a sleeve unit, and an object that is for emitting a light beam; and b) operating the lens unit so that the light beam is received by the lens unit.

Abstract: Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.

Abstract: Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.

Abstract: Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.

Abstract: A probe pin alignment apparatus includes a beam-splitting element, an image-sensing device and a light-reflecting element. The beam-splitting element has a first illuminating surface facing a probe element, a second illuminating surface facing an object, and a light incident surface. The beam-splitting element has a semi-reflective surface for reflecting a light beam from the light incident surface to the probe element. The image-sensing device is disposed externally to the light incident surface of the beam-splitting element. The light-reflecting element, disposed oppositely to the light incident surface, allows a light beam to pass through the semi-reflective surface to be reflected back to the semi-reflective surface to be further projected onto the object. The beam-splitting element outputs a probe image and an object image from the first and second illuminating surfaces through the light incident surface.

Abstract: A probe pin alignment apparatus includes a beam-splitting element, an image-sensing device and a light-reflecting element. The beam-splitting element has a first illuminating surface facing a probe element, a second illuminating surface facing an object, and a light incident surface. The beam-splitting element has a semi-reflective surface for reflecting a light beam from the light incident surface to the probe element. The image-sensing device is disposed externally to the light incident surface of the beam-splitting element. The light-reflecting element, disposed oppositely to the light incident surface, allows a light beam to pass through the semi-reflective surface to be reflected back to the semi-reflective surface to be further projected onto the object. The beam-splitting element outputs a probe image and an object image from the first and second illuminating surfaces through the light incident surface.

Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is fromed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so tat the LED chip is electrically connected to the metal circuit.