Abstract: A backlight module with at least one backup welding spot comprises a backlight module having a support substrate; at least one light emitting diode; at lease one welding spot located near a respective one of the at least one light emitting diode; wherein the welding spot serves to be welded with another light emitting diode so that the another light emitting diode is electrically connected to the support substrate. The support substrate has at least one groove for receiving the light emitting diode. The light emitting diode is enclosed by a lens. When any one of the light emitting diodes on the support substrate cannot work, it is not necessary to detach the lens and the fault light emitting diode. It is only necessary to weld another light emitting diode aside the respective welding spot.

Abstract: An improved bond pad structure for semiconductor devices provides improved electrical isolation between adjacent bond pads by incorporating a pair of pn junctions between the pad and substrate. The pn junctions are defined by a first well of either P of N type material, formed within a substrate, and a second well or region of a P or N type material formed wholly within the first well. A bond wire is secured to an upper surface of the second region such that the wire, first and second regions and substrate are connected in electrical series relationship and provide an equivalent circuit of two series connected diodes reversed in polarity so as to block both negative and positive components of an applied voltage, thus providing electrical isolation for the bond pad structure.