Patents by Inventor T. E. Hsieh

T. E. Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for composite bumps
    Patent number: 5877556
    Abstract: A composite bump structure comprising a first metal layer, a polymer bump formed on the first metal layer, and a second metal layer covering the polymer bump and the first metal layer. The first metal layer is formed above an input/output pad on an integrated circuit element. The polymer bump is positioned substantially off the center of the input/output pad. An open area next to the polymer bump above the input/output pad is established for probing test. The open area having the first and second metal layers and the input/output pad underneath can provide good testability.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: March 2, 1999
    Assignee: Industrial Technology Research Institute
    Inventors: Jen-Huang Jeng, T. E. Hsieh