Patents by Inventor T. Gary Yip

T. Gary Yip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit assembly with heat spreader and method of making the same
    Patent number: 9978663
    Abstract: According to some embodiments of the present invention, a display device includes: a display panel; and an integrated circuit (IC) assembly coupled to the display panel, the IC assembly comprising: a flexible substrate; a first flexible thermally conductive layer on the flexible substrate; and an IC chip on the flexible substrate and thermally coupled to the first flexible thermally conductive layer.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: May 22, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: T. Gary Yip, Amir Amirkhany
  • INTEGRATED CIRCUIT ASSEMBLY WITH HEAT SPREADER AND METHOD OF MAKING THE SAME
    Publication number: 20170170164
    Abstract: According to some embodiments of the present invention, a display device includes: a display panel; and an integrated circuit (IC) assembly coupled to the display panel, the IC assembly comprising: a flexible substrate; a first flexible thermally conductive layer on the flexible substrate; and an IC chip on the flexible substrate and thermally coupled to the first flexible thermally conductive layer.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Inventors: T. Gary Yip, Amir Amirkhany