Patents by Inventor T. H. Ding

T. H. Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for transporting wafers
    Patent number: 6187103
    Abstract: An apparatus and a method for transporting wafers into a process chamber are disclosed. The wafer-transporting blade for transporting wafers consists of a generally elongated blade member that has a top surface for engaging and holding a wafer positioned thereon, wherein at least a portion of the top surface is provided with a surface roughness sufficiently great to frictionally engaging a wafer positioned thereon without slippage. The surface roughness may be provided by either a mechanical or a chemical method.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: February 13, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: C. Y. Huang, T. H. Ding