Patents by Inventor T. Lin

T. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for planarizing gap-filling material
    Publication number: 20060211237
    Abstract: A method an apparatus for fabricating an interconnection structure. A substrate is provided with a dielectric layer thereon. The dielectric layer comprises at least one opening therein. A gap-filling material is applied on the substrate filling the at least one opening. The gap-filling material is planarized using a template to create a substantially planarized surface.
    Type: Application
    Filed: March 21, 2005
    Publication date: September 21, 2006
    Inventors: Kuei-Shun Chen, Chin-Hsiang Lin, T. Lin, Chia-Hsiang Lin
  • Method of improving via filling uniformity in isolated and dense via-pattern regions
    Publication number: 20060110941
    Abstract: An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.
    Type: Application
    Filed: November 22, 2004
    Publication date: May 25, 2006
    Inventors: Yung-Sung Yen, Kuei-Shun Chen, Chia-Hsiang Lin, Lawrence Lin, T. Lin