Patents by Inventor T. T. Chiu

T. T. Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLUNGER/CAVITY COOPERATION WITHOUT CREATION OF SUCTION FORCE DURING WITHDRAWAL
    Publication number: 20120090438
    Abstract: A cavity for receiving insertion of a plunger is designed so that the plunger may be withdrawn without permitting creation of a suction force sufficient to remove from the cavity a workpiece that the plunger carried into the cavity.
    Type: Application
    Filed: November 23, 2010
    Publication date: April 19, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jerry Huang, J. Y. Ho, T. T. Chiu, Chih-Chung Chen
  • Method and apparatus for flip chip device assembly by radiant heating
    Patent number: 7056767
    Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: June 6, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Jimmy Liang, Kevin Jin, T. T. Chiu
  • Method and apparatus for flip chip device assembly by radiant heating
    Publication number: 20040108600
    Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 10, 2004
    Inventors: Jimmy Liang, Kevin Jin, T.T. Chiu
  • Method and apparatus for flip chip device assembly by radiant heating
    Publication number: 20030132528
    Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 17, 2003
    Inventors: Jimmy Liang, Kevin Jin, T. T. Chiu