Abstract: An apparatus includes a voltage regulator operable to regulate a supply voltage to an on-chip module having an operational current, draw a supply current, and supply the operation current to the on-chip module. The supply current drawn by the voltage regulator is proportional to the operating current of the on-chip module.

Abstract: In one embodiment, a system for frequency and phase correction in a phase-locked loop (PLL) includes a phase frequency detector, first and second charge pumps respectively generating a first current and a voltage, a voltage-to-current (V2I) converter, a current summer, and a current-controlled oscillator (CCO). The phase frequency detector detects a frequency difference and a phase difference between a clock signal and a comparison signal, communicates the frequency difference to a first charge pump generating a first current, and communicates the phase difference to a second charge pump generating a voltage. The comparison signal is derived from an output signal of the PLL. The first charge pump modifies the first current according to the frequency difference and communicates the first current to the current summer. The second charge pump modifies the voltage according to the phase difference and communicates the voltage to the V2I converter.

Abstract: A new high quality, low cost, thin-film magnetic recording member is provided, which has a coercive field strength greater than 650 Oe, a saturation magnetization greater than 10,000 Gauss, and a squareness ratio of 0.9 or larger. The member includes a substrate on which is directly sputter deposited a chromium layer, without the use of an intervening nickel-containing layer between the substrate and the chromium. A nickel-cobalt recording layer is then sputter deposited directly onto the chromium layer. In the preferred mode, the start of that nickel-cobalt deposition begins less than 100 seconds after the chromium deposition is terminated and is followed by the sputtering of a protective layer. Before the chromium deposition, the substrate is preheatead to drive off adsorbed gases, and to establish the proper conditions for the chromium deposition. The substrate is also heated during the time between when the chromium deposition ends and the nickel-cobalt deposition begins.