Patents by Inventor Ta-Bin Chen

Ta-Bin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
    Patent number: 6660125
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: December 9, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen
  • Novel sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
    Publication number: 20020127861
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Application
    Filed: December 31, 2001
    Publication date: September 12, 2002
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen
  • Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
    Patent number: 6358851
    Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: March 19, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Ming-Tsong Wang, Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen