Abstract: A method mending the erosion of bonding pad. A passivation layer and a polyimide layer are sequentially formed on a wafer to cover a bonding pad, where the polyimide layer is patterned to expose a portion of the passivation layer. The polyimide layer is used as a mask for etching the passivation layer, so as to expose the bonding pad. The bonding pad is eroded by the etchant residue remaining after etching the passivation layer on the bonding pad. After removing the eroded part of the bonding pad, an oxide layer is formed subsequently to prevent a further erosion.

Abstract: A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding pad is rinsed with deionized water comprising carbon dioxide to reduce the effects of the corrosion phenomenon.