Patents by Inventor Ta-Cheng Liu

Ta-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8723739
    Abstract: A multi-frequency antenna includes a substrate, an antenna portion and a radiator. The antenna portion has a low-frequency radiation antenna and a high-frequency radiation antenna. By selectively coupling the low-frequency radiation antenna, the high-frequency radiation antenna and the radiator, the multi-frequency antenna can work in multiple frequency bands.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: May 13, 2014
    Assignee: Perfect Wireless (Taiwan) Technology Co., Ltd.
    Inventors: Ta-Cheng Liu, Chung-Ta Wu
  • Publication number: 20130300628
    Abstract: A multi-frequency antenna includes a substrate, an antenna portion and a radiator. The antenna portion has a low-frequency radiation antenna and a high-frequency radiation antenna. By selectively coupling the low-frequency radiation antenna, the high-frequency radiation antenna and the radiator, the multi-frequency antenna can work in multiple frequency bands.
    Type: Application
    Filed: May 11, 2012
    Publication date: November 14, 2013
    Inventors: Ta-Cheng LIU, Chung-Ta WU
  • Patent number: 8141611
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: March 27, 2012
    Assignee: HTC Corporation
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • Publication number: 20100107834
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Application
    Filed: April 9, 2009
    Publication date: May 6, 2010
    Applicant: HTC CORPORATION
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • Publication number: 20040068512
    Abstract: A method and a system for processing engineer-designed data are provided. A data receiving/transmitting module receives engineer-designed data from an engineer design department upon receiving a data receiving request from a user through a network terminal device via a network communication system. Then, a data comparison module compares the received engineer-designed data with associated engineer-designed data stored in a database to obtain consistent engineer-designed data. A file producing module transforms the consistent engineer-designed data into a document file in a specific format. The data receiving/transmitting module transmits the transformed document file to an engineer unit corresponding to an engineering stage where the document file is formed. Finally, a data storage module stores the document file confirmed by the engineer unit in the database.
    Type: Application
    Filed: March 5, 2003
    Publication date: April 8, 2004
    Inventors: Ta-Cheng Liu, Jui-Chi Huang, Chiu-Juan Liu, Shu-Yun Chen, Mai-Yi Shen