Abstract: A metal oxide semiconductor field effect transistor power device with a lightly doped silicon substrate includes a source region and a drain region. At least one field implanted island region is formed along the surface of the substrate between the source and drain regions with a field oxide region formed above the field implanted region, a dielectric layer and a gate electrode formed over the substrate, and self-aligned source and drain regions implanted into the device with external electrodes connected thereto.

Abstract: A new method of forming an integrated circuit MNOS/MONOS device with suppressed off-cell leakage current is described. A silicon oxide layer is formed on the surface of a semiconductor substrate. A layer of silicon nitride is deposited over the silicon oxide layer and patterned. A first ion implantation is performed at a tilt angle to form channel stop regions in the semiconductor substrate not covered by the patterned silicon nitride layer wherein the channel stop regions partially extend underneath the patterned silicon nitride layer. The silicon substrate not covered by the patterned silicon nitride layer is oxidized to form field oxide regions within the silicon substrate wherein the channel stop regions extend under the full length of the field oxide regions. The patterned silicon nitride layer is removed. An insulating layer of silicon nitride/silicon oxide (NO) or silicon oxide/silicon nitride/silicon oxide (ONO) is deposited over the surface of the semiconductor substrate.

Abstract: A process for fabricating semiconductor devices having lightly-doped regions in its drain and/or source. The semiconductor device has a gate structure formed on its substrate, and the sidewalls of the gate structure covered by sidewall spacers. The sidewall spacers having a selected thickness obstructs the impurity implantation and constitutes a lightly-doped region in addition to the relatively heavily-doped regions that are not obstructed during the implantation process. Both the lightly- and heavily-doped regions together constitute the drain and/or source of the semiconductor device.

Abstract: A field effect transistor has been developed with one source and one drain but with two independent active regions. It is shown how a double switching characteristic can be obtained with this structure which is described along with a process for its manufacture.

Abstract: A metal oxide semiconductor field effect transistor power device with a lightly doped silicon substrate includes a source region and a drain region. At least one field implanted island region is formed along the surface of the oppositely substrate between the source and drain regions with a field oxide region formed above the field implanted region, a dielectric layer and a gate electrode of matching configurations formed over the substrate, and self-aligned source drain regions implanted into the device with external electrodes connected thereto.