Patents by Inventor Ta-Ching KUAN

Ta-Ching KUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9523375
    Abstract: A fan blade structure applied to a centrifugal fan is provided. The fan blade structure includes a wheel hub and an annular vane. The wheel hub includes a plurality of connecting brackets, and the annular vane includes multiple crests and troughs which interlace to form a continuous curved surface. The continuous curved surface has an outer ring surface and an inner ring surface. The connecting brackets are connected to the inner ring surface and drive the annular vane to rotate.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: December 20, 2016
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ming-Hsiu Wu, Sung-Chuan Huang, Yi-Chi Lai, Ta-Ching Kuan
  • Publication number: 20150030441
    Abstract: A fan blade structure applied to a centrifugal fan is provided. The fan blade structure includes a wheel hub and an annular vane. The wheel hub includes a plurality of connecting brackets, and the annular vane includes multiple crests and troughs which interlace to form a continuous curved surface. The continuous curved surface has an outer ring surface and an inner ring surface. The connecting brackets are connected to the inner ring surface and drive the annular vane to rotate.
    Type: Application
    Filed: December 4, 2013
    Publication date: January 29, 2015
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Ming-Hsiu WU, Sung-Chuan HUANG, Yi-Chi LAI, Ta-Ching KUAN
  • Publication number: 20140311713
    Abstract: A heat dissipation component includes a first film, a second film, and a working fluid. The second film is connected with a part of the first film to form a plurality of vein channels. The vein channels include a main vein channel and a plurality of branch vein channels, and the main vein channel is connected with the branch vein channels. The working fluid is disposed in the vein channels. The heat dissipation component is bendable to be easily assembled with an electronic device. The working fluid may flow in the vein channels via a pressure difference generated by a phase transition, gravity, and a capillary effect, or via a pressure difference generated, by a pulse generator to transfer the heat to the whole heat dissipation component. The first film and the second film may have heat conduction material to improve the heat transfer rate.
    Type: Application
    Filed: August 12, 2013
    Publication date: October 23, 2014
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Ming-Hsiu WU, Ta-Ching KUAN
  • Patent number: D732656
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: June 23, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ming-Hsiu Wu, Sung-Chuan Huang, Yi-Chi Lai, Ta-Ching Kuan
  • Patent number: D744085
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: November 24, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ming-Hsiu Wu, Sung-Chuan Huang, Yi-Chi Lai, Ta-Ching Kuan