Patents by Inventor Ta-Chun Ma
Ta-Chun Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250098280Abstract: A method includes forming a fin extending from a substrate; depositing a liner over a top surface and sidewalls of the fin, where the minimum thickness of the liner is dependent on selected according to a first germanium concentration of the fin; forming a shallow trench isolation (STI) region adjacent the fin; removing a first portion of the liner on sidewalls of the fin, the first portion of the liner being above a topmost surface of the STI region; and forming a gate stack on sidewalls and a top surface of the fin, where the gate stack is in physical contact with the liner.Type: ApplicationFiled: December 2, 2024Publication date: March 20, 2025Inventors: Yi-Cheng Li, Pin-Ju Liang, Ta-Chun Ma, Pei-Ren Jeng, Yee-Chia Yeo
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Publication number: 20250089286Abstract: A fin field effect transistor device structure includes a fin structure formed over a substrate. The structure also includes a liner layer and an isolation structure surrounding the fin structure. The structure also includes a gate dielectric layer formed over the fin structure and the isolation structure. The structure also includes a gate structure formed over the gate dielectric layer. The structure also includes source/drain epitaxial structures formed on opposite sides of the gate structure. The fin structure includes a protruding portion laterally extending over the liner layer.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Inventors: Ta-Chun Ma, Yee-Chia Yeo
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Publication number: 20250048716Abstract: Embodiments utilize a silicon germanium layer deposited to a low germanium percentage under a substrate. The substrate is used to form a field effect transistor FET structure. After formation of the FET, the silicon germanium layer is oxidized to drive germanium to a concentrated sublayer of the silicon germanium layer. The sublayer is used as a stop layer to remove the oxidized portion of the silicon germanium layer.Type: ApplicationFiled: August 4, 2023Publication date: February 6, 2025Inventors: Yen Chuang, Ji-Yin Tsai, Jet-Rung Chang, Zheng Hui Lim, Ta-Chun Ma
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Publication number: 20250048689Abstract: Methods of forming a stacked transistor are provided. One representative method may include patterning a first dummy nanostructure, a second dummy nanostructure, and a semiconductor nanostructure. The semiconductor nanostructure may be disposed between the first dummy nanostructure and the second dummy nanostructure. The first dummy nanostructure may comprise a first semiconductor material and the second dummy nanostructure may comprise a superlattice structure. The representative method may also include performing an etching process that simultaneously recesses the first dummy nanostructure to form a sidewall recess and removes the second dummy nanostructure to form an opening. The etching process selectively etches the superlattice structure at a faster rate than the first semiconductor material. The representative method may further include forming an inner spacer and an isolation structure in, respectively, the sidewall recess and the opening.Type: ApplicationFiled: August 3, 2023Publication date: February 6, 2025Inventors: Ji-Yin Tsai, Zheng Hui Lim, Yen Chuang, Jet-Rung Chang, Ta-Chun Ma, Chii-Horng Li
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Publication number: 20250022956Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, a nanostructured channel region disposed on the substrate, a gate structure surrounding the nanostructured channel region, a source/drain (S/D) region disposed adjacent to the nanostructured channel region, an etch stop layer (ESL) disposed on the S/D region, a stress liner disposed on the etch stop layer and configured to provide compressive stress in the nanostructured channel region, an inter-layer dielectric (ILD) layer disposed on the stress liner, and a contact structure disposed in the S/D region, ESL, stress liner, and ILD layer.Type: ApplicationFiled: November 17, 2023Publication date: January 16, 2025Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Cheng LI, Jheng-Wei LIN, Ta-Chun MA
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Patent number: 12191378Abstract: A fin field effect transistor device structure includes a fin structure formed over a substrate. The structure also includes a liner layer and an isolation structure surrounding the fin structure. The structure also includes a gate dielectric layer formed over the fin structure and the isolation structure. The structure also includes a gate structure formed over the gate dielectric layer. The structure also includes source/drain epitaxial structures formed on opposite sides of the gate structure. The fin structure includes a protruding portion laterally extending over the liner layer.Type: GrantFiled: February 11, 2022Date of Patent: January 7, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ta-Chun Ma, Yee-Chia Yeo
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Patent number: 12191212Abstract: A method includes forming a fin extending from a substrate; depositing a liner over a top surface and sidewalls of the fin, where the minimum thickness of the liner is dependent on selected according to a first germanium concentration of the fin; forming a shallow trench isolation (STI) region adjacent the fin; removing a first portion of the liner on sidewalls of the fin, the first portion of the liner being above a topmost surface of the STI region; and forming a gate stack on sidewalls and a top surface of the fin, where the gate stack is in physical contact with the liner.Type: GrantFiled: May 5, 2022Date of Patent: January 7, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Cheng Li, Pin-Ju Liang, Ta-Chun Ma, Pei-Ren Jeng, Yee-Chia Yeo
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Patent number: 11854901Abstract: A device is manufactured by providing a semiconductor fin protruding from a major surface of a silicon substrate comprising silicon. A liner and a shallow trench isolation (STI) region are formed adjacent the semiconductor fin. A silicon cap is deposited over the semiconductor fin. The resulting cap consists of crystalline silicon in the portion over the semiconductor fin and consists of amorphous silicon in the portions over the liner and STI region. An HCl etch bake process is performed to remove the portions of amorphous silicon over the liner and the STI region.Type: GrantFiled: June 17, 2022Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen
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Publication number: 20230343595Abstract: A semiconductor device includes first and second semiconductor fins, a first gate structure, and a second gate structure. The first and second semiconductor fins respectively includes a first channel region and a second channel region, which the first and second gate structures are respectively on. The first gate structure includes a first silicon oxide layer on the first channel region, a first high-k dielectric layer on the first silicon oxide layer, and a first metal gate on the first high-k dielectric layer. The second gate structure includes a second silicon oxide layer on the second channel region, a second high-k dielectric layer on the second silicon oxide layer, and a second metal gate on the second high-k dielectric layer. The first silicon oxide layer has a Si4+ ion concentration greater than a Si4+ ion concentration of a bottom portion of the second silicon oxide layer.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Andrew Joseph KELLY, Yusuke ONIKI, Yasutoshi OKUNO, Ta-Chun MA
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Patent number: 11728169Abstract: A semiconductor device includes first and second semiconductor fins, a first gate structure, and a second gate structure. The first and second semiconductor fins respectively includes a first channel region and a second channel region, which the first and second gate structures are respectively on. The first gate structure includes a first silicon oxide layer on the first channel region, a first high-k dielectric layer on the first silicon oxide layer, and a first metal gate on the first high-k dielectric layer. The second gate structure includes a second silicon oxide layer on the second channel region, a second high-k dielectric layer on the second silicon oxide layer, and a second metal gate on the second high-k dielectric layer. The first silicon oxide layer has a Si4+ ion concentration greater than a Si4+ ion concentration of a bottom portion of the second silicon oxide layer.Type: GrantFiled: August 31, 2020Date of Patent: August 15, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Andrew Joseph Kelly, Yusuke Oniki, Yasutoshi Okuno, Ta-Chun Ma
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Publication number: 20230019633Abstract: A method includes forming a fin extending from a substrate; depositing a liner over a top surface and sidewalls of the fin, where the minimum thickness of the liner is dependent on selected according to a first germanium concentration of the fin; forming a shallow trench isolation (STI) region adjacent the fin; removing a first portion of the liner on sidewalls of the fin, the first portion of the liner being above a topmost surface of the STI region; and forming a gate stack on sidewalls and a top surface of the fin, where the gate stack is in physical contact with the liner.Type: ApplicationFiled: May 5, 2022Publication date: January 19, 2023Inventors: Yi-Cheng Li, Pin-Ju Liang, Ta-Chun Ma, Pei-Ren Jeng, Yee-Chia Yeo
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Publication number: 20220328358Abstract: A device is manufactured by providing a semiconductor fin protruding from a major surface of a silicon substrate comprising silicon. A liner and a shallow trench isolation (STI) region are formed adjacent the semiconductor fin. A silicon cap is deposited over the semiconductor fin. The resulting cap consists of crystalline silicon in the portion over the semiconductor fin and consists of amorphous silicon in the portions over the liner and STI region. An HCl etch bake process is performed to remove the portions of amorphous silicon over the liner and the STI region.Type: ApplicationFiled: June 17, 2022Publication date: October 13, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen
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Patent number: 11367660Abstract: A device is manufactured by providing a semiconductor fin protruding from a major surface of a silicon substrate comprising silicon. A liner and a shallow trench isolation (STI) region are formed adjacent the semiconductor fin. A silicon cap is deposited over the semiconductor fin. The resulting cap consists of crystalline silicon in the portion over the semiconductor fin and consists of amorphous silicon in the portions over the liner and STI region. An HCl etch bake process is performed to remove the portions of amorphous silicon over the liner and the STI region.Type: GrantFiled: December 14, 2020Date of Patent: June 21, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen
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Publication number: 20220165869Abstract: A fin field effect transistor device structure includes a fin structure formed over a substrate. The structure also includes a liner layer and an isolation structure surrounding the fin structure. The structure also includes a gate dielectric layer formed over the fin structure and the isolation structure. The structure also includes a gate structure formed over the gate dielectric layer. The structure also includes source/drain epitaxial structures formed on opposite sides of the gate structure. The fin structure includes a protruding portion laterally extending over the liner layer.Type: ApplicationFiled: February 11, 2022Publication date: May 26, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ta-Chun MA, Yee-Chia YEO
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Patent number: 11257932Abstract: A method for forming a fin field effect transistor device structure includes forming a fin structure over a substrate. The method also includes forming an isolation structure surrounding the fin structure. The method also includes cleaning sidewalls of the fin structure. The method also includes depositing a silicon cap layer over the fin structure. The method also includes growing an oxide layer over the silicon cap layer. The silicon cap layer is thinned after growing an oxide layer over the silicon cap layer. The method also includes forming a gate structure over the oxide layer across the fin structure. The method also includes growing a source/drain epitaxial structure beside the gate structure. The method also includes forming a contact structure electrically connected to the gate structure.Type: GrantFiled: June 12, 2020Date of Patent: February 22, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ta-Chun Ma, Yee-Chia Yeo
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Publication number: 20210366715Abstract: In an embodiment, a method includes: forming a first fin extending from a substrate, the substrate including silicon, the first fin including silicon germanium; forming an isolation region around the first fin, an oxide layer being formed on the first fin during formation of the isolation region; removing the oxide layer from the first fin with a hydrogen-based etching process, silicon at a surface of the first fin being terminated with hydrogen after the hydrogen-based etching process; desorbing the hydrogen from the silicon at the surface of the first fin to depassivate the silicon; and exchanging the depassivated silicon at the surface of the first fin with germanium at a subsurface of the first fin.Type: ApplicationFiled: August 9, 2021Publication date: November 25, 2021Inventors: Ta-Chun Ma, Yi-Cheng Li, Pin-Ju Liang, Cheng-Po Chau, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen, Cheng-Hsiung Yen
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Patent number: 11087987Abstract: In an embodiment, a method includes: forming a first fin extending from a substrate, the substrate including silicon, the first fin including silicon germanium; forming an isolation region around the first fin, an oxide layer being formed on the first fin during formation of the isolation region; removing the oxide layer from the first fin with a hydrogen-based etching process, silicon at a surface of the first fin being terminated with hydrogen after the hydrogen-based etching process; desorbing the hydrogen from the silicon at the surface of the first fin to depassivate the silicon; and exchanging the depassivated silicon at the surface of the first fin with germanium at a subsurface of the first fin.Type: GrantFiled: July 1, 2019Date of Patent: August 10, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ta-Chun Ma, Yi-Cheng Li, Pin-Ju Liang, Cheng-Po Chau, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen, Cheng-Hsiung Yen
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Publication number: 20210242332Abstract: A method for forming a fin field effect transistor device structure includes forming a fin structure over a substrate. The method also includes forming an isolation structure surrounding the fin structure. The method also includes cleaning sidewalls of the fin structure. The method also includes depositing a silicon cap layer over the fin structure. The method also includes growing an oxide layer over the silicon cap layer. The silicon cap layer is thinned after growing an oxide layer over the silicon cap layer. The method also includes forming a gate structure over the oxide layer across the fin structure. The method also includes growing a source/drain epitaxial structure beside the gate structure. The method also includes forming a contact structure electrically connected to the gate structure.Type: ApplicationFiled: June 12, 2020Publication date: August 5, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ta-Chun MA, Yee-Chia YEO
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Publication number: 20210098308Abstract: A device is manufactured by providing a semiconductor fin protruding from a major surface of a silicon substrate comprising silicon. A liner and a shallow trench isolation (STI) region are formed adjacent the semiconductor fin. A silicon cap is deposited over the semiconductor fin. The resulting cap consists of crystalline silicon in the portion over the semiconductor fin and consists of amorphous silicon in the portions over the liner and STI region. An HCl etch bake process is performed to remove the portions of amorphous silicon over the liner and the STI region.Type: ApplicationFiled: December 14, 2020Publication date: April 1, 2021Inventors: Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Kei-Wei Chen
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Publication number: 20200395216Abstract: A semiconductor device includes first and second semiconductor fins, a first gate structure, and a second gate structure. The first and second semiconductor fins respectively includes a first channel region and a second channel region, which the first and second gate structures are respectively on. The first gate structure includes a first silicon oxide layer on the first channel region, a first high-k dielectric layer on the first silicon oxide layer, and a first metal gate on the first high-k dielectric layer. The second gate structure includes a second silicon oxide layer on the second channel region, a second high-k dielectric layer on the second silicon oxide layer, and a second metal gate on the second high-k dielectric layer. The first silicon oxide layer has a Si4+ ion concentration greater than a Si4+ ion concentration of a bottom portion of the second silicon oxide layer.Type: ApplicationFiled: August 31, 2020Publication date: December 17, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Andrew Joseph KELLY, Yusuke ONIKI, Yasutoshi OKUNO, Ta-Chun MA