Patents by Inventor Ta-Fa Lin

Ta-Fa Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE
    Publication number: 20090253230
    Abstract: A method for manufacturing a stack chip package structure is disclosed. The method comprises: providing a first substrate; disposing a first chip on the first substrate; disposing a second chip and at least one second substrate on the first chip, wherein the second substrate is electrically connected to the first chip; bonding at least one first connecting wire connected between the second chip and the second substrate; bonding at least one second connecting wire connected between the first substrate and the second substrate; and forming a package body on the first substrate to encapsulate the first chip, the second chip, the second substrate, the first connecting wire and the second connecting wire.
    Type: Application
    Filed: June 17, 2009
    Publication date: October 8, 2009
    Inventors: Yueh-Ming TUNG, Chia-Ming Yang, Shu-Hui Lin, Ta-Fa Lin, Mien-Fang Sung
  • STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20090189295
    Abstract: A stack chip package structure and a manufacturing method thereof are disclosed. The method comprises: providing a first substrate; disposing a first chip on the first substrate; disposing a second chip and at least one second substrate on the first chip, wherein the second substrate is electrically connected to the first chip; bonding at least one first connecting wire connected between the second chip and the second substrate; bonding at least one second connecting wire connected between the first substrate and the second substrate; and forming a package body on the first substrate to encapsulate the first chip, the second chip, the second substrate, the first connecting wire and the second connecting wire.
    Type: Application
    Filed: May 13, 2008
    Publication date: July 30, 2009
    Inventors: Yueh-Ming TUNG, Chia-Ming Yang, Shu-Hui Lin, Ta-Fa Lin, Mien-Fang Sung