Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: There is provided an antenna device comprising: a chip antenna arranged on a substrate; and a metal element arranged on the same substrate as the chip antenna, wherein the metal element is arranged such that a longitudinal direction of the metal element is vertical with respect to the substrate in a direction in which a current flows in the chip antenna.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.

Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.

Abstract: A waveguide structure and a method of manufacturing the same, and an electronic device are provided. The electronic device includes a control module, an antenna module and a waveguide structure connected between the control module and the antenna module. The waveguide structure includes an insulating carrier component and a conductive metal component. The insulating carrier component includes a first insulating carrier and a second insulating carrier matching with the first insulating carrier. The first insulating carrier includes a first groove, and the second insulating carrier includes a second groove in communication with the first groove. The conductive metal component includes a first conductive body accommodated in the first groove of the first insulating carrier and a second conductive body accommodated in the second groove of the second insulating carrier, and the conductive metal component includes a penetrating channel passing therethrough.

Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.

Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.

Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.

Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure and separate from the outer surrounding radiation structure. The first outer feeding structure corresponds to the first inner feeding structure.

Abstract: A waveguide structure and a method of manufacturing the same, and an electronic device are provided. The electronic device includes a control module, an antenna module and a waveguide structure connected between the control module and the antenna module. The waveguide structure includes an insulating carrier component and a conductive metal component. The insulating carrier component includes a first insulating carrier and a second insulating carrier matching with the first insulating carrier. The first insulating carrier includes a first groove, and the second insulating carrier includes a second groove in communication with the first groove. The conductive metal component includes a first conductive body accommodated in the first groove of the first insulating carrier and a second conductive body accommodated in the second groove of the second insulating carrier, and the conductive metal component includes a penetrating channel passing therethrough.

Abstract: A co-construction antenna module includes a carrier, a first patch antenna group, a second patch antenna group, a first dipole antenna group, and a second dipole antenna group. The carrier includes a first surface, a second surface relative to the first surface, and a surround surrounding side connected between the first surface and the second surface. The first patch antenna group includes a plurality of first patch antennas disposed on the carrier, and the plurality of first patch antennas are disposed on at least one of the first surface and the second surface. The second patch antenna group includes a plurality of second patch antennas disposed on the carrier, and the plurality of second patch antennas are disposed on at least one of the first surface and the second surface. The first dipole antenna group and the second antenna are disposed in the carrier.

Abstract: A co-construction antenna module includes a carrier, a first patch antenna group, a second patch antenna group, a first dipole antenna group, and a second dipole antenna group. The carrier includes a first surface, a second surface relative to the first surface, and a surround surrounding side connected between the first surface and the second surface. The first patch antenna group includes a plurality of first patch antennas disposed on the carrier, and the plurality of first patch antennas are disposed on at least one of the first surface and the second surface. The second patch antenna group includes a plurality of second patch antennas disposed on the carrier, and the plurality of second patch antennas are disposed on at least one of the first surface and the second surface. The first dipole antenna group and the second antenna are disposed in the carrier.

Abstract: The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.

Abstract: The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.

Abstract: A plate antenna module includes a first substrate unit, a second substrate unit, an adhesive unit and a pin unit. The first substrate unit including a first substrate body and a first electrode layer disposed on the top side of the first substrate body. The second substrate unit including a second substrate body disposed on the bottom side of the first substrate body, and the second substrate body has a second dielectric constant different from the first dielectric constant of the first substrate body. The adhesive unit includes a first adhesive sheet adhesively disposed between the first substrate body and the second substrate body and a second adhesive sheet adhered to the bottom side of the second substrate body. The pin unit includes a feeding pin electrically contacting the first electrode layer and sequentially passing through the first substrate unit, the second substrate unit and the adhesive unit.

Abstract: A circular polarization antenna structure with a dual-layer ceramic includes a first hard dielectric body, a first metal layer, a grounding layer, an antenna feed pin, a second hard dielectric body, a second metal layer and an adhesive element. The first metal layer and the grounding layer dispose on a top surface and a bottom surface of the first hard dielectric body. The antenna feed pin passes through the through hole of the first hard dielectric body, the top side of the antenna feed pin is fixed on the top surface of the first hard dielectric body, and the bottom side of the antenna feed pin extends outwards from the bottom surface of the first hard dielectric body. The second hard dielectric body disposes above the top side of the first hard dielectric body. The second metal layer disposes on the top surface of the second hard dielectric body.

Abstract: A circular polarization antenna structure with a dual-layer ceramic includes a first hard dielectric body, a first metal layer, a grounding layer, an antenna feed pin, a second hard dielectric body, a second metal layer and an adhesive element. The first metal layer and the grounding layer dispose on a top surface and a bottom surface of the first hard dielectric body. The antenna feed pin passes through the through hole of the first hard dielectric body, the top side of the antenna feed pin is fixed on the top surface of the first hard dielectric body, and the bottom side of the antenna feed pin extends outwards from the bottom surface of the first hard dielectric body. The second hard dielectric body disposes above the top side of the first hard dielectric body. The second metal layer disposes on the top surface of the second hard dielectric body.