Abstract: A vibration assistant polishing module which comprises a polishing disk, a workpiece carrier tray, a linear guide way mechanism, a linkage, a motor and an adjustable eccentricity mechanism. The linear guide way mechanism includes a slide, a guide seat and a guide rod. The slide is pivot jointed with workpiece carrier tray and engaged in guide seat. The adjustable eccentricity mechanism comprises a base which is connected with a power shaft of the motor, and a pivot shaft of base and linkage is eccentric to the power shaft. The power shaft drives the base rotating and the linkage swinging eccentrically, and the slide moves linearly according to the limitation from guide seat, and a horizontal radial vibration and low frequency vibration is generated on the workpiece carrier tray, so the low frequency vibration is generated on the surface of the workpiece which is touched with the polishing disk.

Abstract: A vibration assistant polishing module which comprises a polishing disk, a workpiece carrier tray, a linear guide way mechanism, a linkage, a motor and an adjustable eccentricity mechanism. The linear guide way mechanism includes a slide, a guide seat and a guide rod. The slide is pivot jointed with workpiece carrier tray and engaged in guide seat. The adjustable eccentricity mechanism comprises a base which is connected with a power shaft of the motor, and a pivot shaft of base and linkage is eccentric to the power shaft. The power shaft drives the base rotating and the linkage swinging eccentrically, and the slide moves linearly according to the limitation from guide seat, and a horizontal radial vibration and low frequency vibration is generated on the workpiece carrier tray, so the low frequency vibration is generated on the surface of the workpiece which is touched with the polishing disk.

Abstract: A touch sensor is provided. The touch sensor includes a first buffer layer disposed on a substrate, a first electrode layer disposed on the first buffer layer, a second buffer layer disposed on the first electrode layer and a second electrode layer disposed on the second buffer layer and electrically connected with the first electrode layer, wherein the first and second buffer layers are formed of the same material including an insulated metal oxide, and the first and second electrode layers are formed of the same material including a doped metal oxide.

Abstract: A method applying a circular photonic crystal structure to improve optical properties of a photoelectric conversion device such as a light emitting diode device, an organic light emitting diode device or a solar cell is provided, wherein the circular photonic crystal structure is configured on a junction surface between two different mediums where passes a light emitted or received by the photoelectric conversion device. The circular photonic crystal structure provides isotropic photonic band gap which conduces high light extraction efficiency.

Abstract: A touch sensor is provided. The touch sensor includes a first buffer layer disposed on a substrate, a first electrode layer disposed on the first buffer layer, a second buffer layer disposed on the first electrode layer and a second electrode layer disposed on the second buffer layer and electrically connected with the first electrode layer, wherein the first and second buffer layers are formed of the same material including an insulated metal oxide, and the first and second electrode layers are formed of the same material including a doped metal oxide.

Abstract: A light-emitting diode (LED) array light source includes a substrate, a meshed light-shielding layer, LED chips, and a micro-lens array. The meshed light-shielding layer includes bar-shaped light-shielding patterns intersected with one another to define openings. Each bar-shaped light-shielding pattern has a bottom surface, a top surface, and two side surfaces. A width of the top surface is smaller than that of the bottom surface. A thickness of the meshed light-shielding layer is T1. Each LED chip is exclusively located in one of the openings. The micro-lens array covers the substrate, the meshed light-shielding layer, and the LED chips and includes micro-lenses arranged in array. Each micro-lens includes a base portion and a lens portion, and is disposed corresponding to one of the openings, respectively. A vertical distance from a top portion of each micro-lens to the bottom surface is T2, and 0.278?T1/T2?0.833.

Abstract: A method for deposition of a selenium thin-film includes the following steps. First, a plasma head is provided. Then, a substrate is supported in an atmospheric pressure. Next, a solid-state selenium source is dissociated by the plasma head to deposit the selenium thin-film on the substrate. The plasma head includes a chamber, a housing and the solid-state selenium source. Plasma is produced in the chamber. The chamber is surrounded by the housing. The solid-state selenium source is supported by the housing.

Abstract: A method applying a circular photonic crystal structure to improve optical properties of a photoelectric conversion device such as a light emitting diode device, an organic light emitting diode device or a solar cell is provided, wherein the circular photonic crystal structure is configured on a junction surface between two different mediums where passes a light emitted or received by the photoelectric conversion device. The circular photonic crystal structure provides isotropic photonic band gap which conduces high light extraction efficiency.

Abstract: A water purification system performs a water purification process through physical sterilization, and at least includes a compression device and a decompression device. Water is converted into a high-pressure liquid through the compression device, and then is converted into a high-speed fluid by controlling the cross-sectional area of a spout of the decompression device, thus generating physical effects such as pressure drop and shear stress, so as to damage cell walls of bacteria in the liquid to die-off the bacteria. Therefore, purified water is obtained.

Abstract: A water purification system performs a water purification process through physical sterilization, and at least includes a compression device and a decompression device. Water is converted into a high-pressure liquid through the compression device, and then is converted into a high-speed fluid by controlling the cross-sectional area of a spout of the decompression device, thus generating physical effects such as pressure drop and shear stress, so as to damage cell walls of bacteria in the liquid to die-off the bacteria. Therefore, purified water is obtained.

Abstract: A load-adjustable SAW (Surface Acoustic Wave) actuator arrangement includes a platform having two sliding bearings symmetrically disposed at two sides; a SAW actuator disposed in the platform between the sliding bearings for producing a surface acoustic wave at the top surface thereof, a slider disposed inside the platform and movable by the SAW actuator along the sliding bearings, and a support structure. The slider has a pressure bearing structure disposed in contact with the top surface of the SAW actuator and two positioning portions respectively supported on the sliding bearings. The support structure applies a predetermined force to the slider subject to the load carried on the slider, keeping the contact pressure between the slider and the SAW actuator about a constant value.

Abstract: A hand-held optical fiber cutting apparatus comprises a base, and a cutting device and a bending device, comprised of a pushing shaft mounted on the cutting device, that slide to perform cutting. The base includes an optical fiber guiding support to receive the optical fiber to be cut. Via a manual switch, an optical fiber clamp pivotably mounted onto the base can rotatably open or close to clamp the optical fiber. The bending device further includes a bending base pivotably assembled with the base. To cut the optical fiber, the cutting device and the pushing shaft slide toward the clamped optical fiber that is sequentially precut via a cutting blade of the cutting device and then cut off via a rotation of the bending base pushed by the pushing shaft.

Abstract: A particulate grinding method and device applies different force fields to drive the grinding medium and the particulates move in different routes but collide only at a grinding area so that they are separated naturally without conventional screening mechanisms, such as a screen or a gap, and prevented from the limitation of mechanical size of the components. Moreover, the invention is applicable to finer particulates. The circulation of particulates is not limited by any small gap of screening mechanisms, so the particulates ill not block the separator.

Abstract: A particulate grinding method and device applies different force fields to drive the grinding medium and the particulates move in different routes but collide only at a grinding area so that they are separated naturally without conventional screening mechanisms, such as a screen or a gap, and prevented from the limitation of mechanical size of the components. Moreover, the invention is applicable to finer particulates. The circulation of particulates is not limited by any small gap of screening mechanisms, so the particulates will not block the separator.

Abstract: A hand-held optical fiber cutting apparatus comprises a base, and a cutting device and a bending device, comprised of a pushing shaft mounted on the cutting device, that slide to perform cutting. The base includes an optical fiber guiding support to receive the optical fiber to be cut. Via a manual switch, an optical fiber clamp pivotably mounted onto the base can rotatably open or close to clamp the optical fiber. The bending device further includes a bending base pivotably assembled with the base. To cut the optical fiber, the cutting device and the pushing shaft slide toward the clamped optical fiber that is sequentially precut via a cutting blade of the cutting device and then cut off via a rotation of the bending base pushed by the pushing shaft.