Abstract: A flip-chip LED, a method for manufacturing the same and a flip-chip LED package are revealed. The LED includes at least one multi-layer reflective layer covered over the outermost layer thereof. The multi-layer reflective layer includes non-conductive reflective layer or combination of the non-conductive reflective layer with conductive reflective layer. The multi-layer reflective layer is manufactured by physical vapor deposition (PVD) with a mask at one time. The mask is used to form a pattern of the multi-layer reflective layer. Thus a photoresist layer is further formed on surface of exposed electrodes. Then a pumping and venting process is used only once during to complete vacuum deposition of each layer of the multi-layer reflective layer in turn.

Abstract: A flip-chip LED, a method for manufacturing the same and a flip-chip LED package are revealed. The LED includes at least one multi-layer reflective layer covered over the outermost layer thereof. The multi-layer reflective layer includes non-conductive reflective layer or combination of the non-conductive reflective layer with conductive reflective layer. The multi-layer reflective layer is manufactured by physical vapor deposition (PVD) with a mask at one time. The mask is used to form a pattern of the multi-layer reflective layer. Thus a photoresist layer is further formed on surface of exposed electrodes. Then a pumping and venting process is used only once during to complete vacuum deposition of each layer of the multi-layer reflective layer in turn.

Abstract: Electroless nickel bumps of die pads and a method thereof are disclosed. A protection layer is formed on the top surface and a surrounding sidewall of each electroless nickel bump in turn or at the same time by two separated processes or the same process. The two separated processes are selected from the group consisting of immersion gold and immersion silver. Thereby hardness of the top surface of the electroless nickel bump is improved and reduced. Moreover, easy oxidation of the surrounding sidewall of the electroless nickel bump and short circuit of the bump caused by electron migration can both be avoided.

Abstract: An attachment card for Subscriber Identity Module (SIM) cards and a method for manufacturing the same are revealed. The attachment card includes a flexible printed circuit board (FPC) and a chip. The chip is disposed on one surface of the FPC with a plurality of bumps, located at a central area among preset positions for formation of the bumps. The bumps are arranged according to the established specification. The method includes several steps. First arrange a chip at a central area of a FPC by surface mount technology. Then form a plurality of bumps on one surface of the FPC. Thereby the requirement of compact size is achieved. The manufacturing processes are also simplified. Thus the cost is reduced and the attachment card has more application.

Abstract: A plasma measurement device used for measuring plasma characteristics of radio frequency plasma a probe, a connector electronic wire, and a power supply device. The probe is used for entering the radio frequency plasma to measure the plasma characteristics. One end of the connector electronic wire is electrically connected to the probe. The power supply device is electrically connected to another end of the connector electronic wire, and the power supply device is used for providing a voltage to the probe. The connector electronic wire is a specific length, and the connector electronic wire and the radio frequency plasma would generate a standing wave effect. Thus, according to the standing wave effect, the plasma measurement device could eliminate high-frequency interference generated by the radio frequency plasma while measuring the plasma characteristics.

Abstract: A plasma measurement device used for measuring plasma characteristics of radio frequency plasma is disclosed. The plasma measurement device comprises a probe, a connector electronic wire, and a power supply device. The probe is used for entering the radio frequency plasma to measure the plasma characteristics. One end of the connector electronic wire is electrically connected to the probe. The power supply device is electrically connected to another end of the connector electronic wire, and the power supply device is used for providing a voltage to the probe. Wherein the connector electronic wire is in a specific length, and the connector electronic wire and the radio frequency plasma would generate a standing wave effect, such that according to the standing wave effect, the plasma measurement device could eliminate high-frequency interference generated by the radio frequency plasma while measuring the plasma characteristics.

Abstract: A nuclear fuel arrangement in fuel pools for nuclear power plant is disclosed, which comprises: a plurality of nuclear fuel bundles, being arranged in a tight formation; a pool partition framework, formed with a plurality of grids for storing the plural nuclear fuel bundles; wherein the partition frame has a plurality of blocks of different heights disposed at the bottoms of their corresponding grids to be used for enabling any neighboring nuclear fuel bundles in the tight formation to be ruggedly arranged with different heights.

Abstract: A dry storage of nuclear fuel is disclosed, which comprises: a plurality of nuclear fuel bundles, being arranged in a tight formation; a dry storage canister, formed with a cavity inside to be used for storing the plural nuclear fuel bundles; wherein the cavity is formed with a plurality of blocks of different heights at the top and bottom thereof that each of the blocks on the top and bottom are provided for one of the plural nuclear fuel bundles to mounted fixedly thereon for enabling any neighboring nuclear fuel bundles in the tight formation to be ruggedly arranged with different heights.