Abstract: A method of manufacturing a flexible display device includes: forming an integrated circuit chip, a flexible printed circuit board and a frontplane laminate over a driving substrate; adhering a front protective layer over the frontplane laminate and the flexible printed circuit board, such that the front protective layer is in contact with the frontplane laminate, in which the front protective layer has a first opening corresponding to the integrated circuit chip; and filling a second adhesive into the first opening and covering an upper surface, a side surface or a combination thereof of the integrated circuit chip. A flexible display device is also provided.

Abstract: A method of manufacturing a flexible display device includes: forming an integrated circuit chip, a flexible printed circuit board and a frontplane laminate over a driving substrate; adhering a front protective layer over the frontplane laminate and the flexible printed circuit board, such that the front protective layer is in contact with the frontplane laminate, in which the front protective layer has a first opening corresponding to the integrated circuit chip; and filling a second adhesive into the first opening and covering an upper surface, a side surface or a combination thereof of the integrated circuit chip. A flexible display device is also provided.

Abstract: A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.

Abstract: The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

Abstract: A manufacturing method for a display module is provided. The method comprises following steps. A module structure comprising a cover plate, a substrate, and a front plate disposed between the cover plate and the substrate is provided. A space is defined by a lower surface of the cover plate, an upper surface of the substrate, and a side surface of the front plate. A holding structure comprising a holding layer disposed under the module structure is provided. A sealant is filled into the space. Portions of the package layer and the holding structure disposed outside a side surface of the cover plate and a side surface of the substrate are removed.

Abstract: A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Abstract: A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. Thereafter, the second substrate is peeled off from the first substrate.

Abstract: A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.

Abstract: A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.

Abstract: A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Abstract: A manufacturing method for a display module is provided. The method comprises following steps. A module structure comprising a cover plate, a substrate, and a front plate disposed between the cover plate and the substrate is provided. A space is defined by a lower surface of the cover plate, an upper surface of the substrate, and a side surface of the front plate. A holding structure comprising a holding layer disposed under the module structure is provided. A sealant is filled into the space. Portions of the package layer and the holding structure disposed outside a side surface of the cover plate and a side surface of the substrate are removed.

Abstract: A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Abstract: The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

Abstract: A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Abstract: A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and then illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. After that, the second substrate is peeled off from the first substrate.

Abstract: A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

Abstract: A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

Abstract: A display apparatus includes a display panel, at least one anisotropic conductive adhesive and at least one chip. The display panel has a peripheral circuit region, and the anisotropic conductive adhesive is adhered in the peripheral circuit region. The chip is disposed on the anisotropic conductive adhesive, and the chip has an electric coupling region on a surface facing the anisotropic conductive adhesive. The electric coupling region is equipped with a plurality of electric coupling parts, and the electric coupling parts are electrically coupled to the peripheral circuit region by the anisotropic conductive adhesive. An interval is existed between a boundary of the electric coupling region and a boundary of the chip, and the electric coupling region is located in a bonding region of the anisotropic conductive adhesive. The bonding region of the anisotropic conductive adhesive is located in the boundary of the chip. The display apparatus has better reliability.

Abstract: A display device includes an array substrate, an electronic paper display medium, a counter substrate, a supporting layer, and an adhesive. The electronic paper display medium is disposed on the array substrate. The counter substrate is disposed on the electronic paper display medium. The adhesive adheres the supporting layer to a surface of the array substrate facing away from the electronic paper display medium.

Abstract: A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.