Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.