Patents by Inventor Ta-Shuong Yeh

Ta-Shuong Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the preparation of direct tabletting formulations and aids
    Patent number: 6761905
    Abstract: A thermal adhesion granulation process for preparing direct tabletting formulations or aids is disclosed. The process comprises the step of subjecting all or part of a mixture comprising: A) from about 5 to about 99% by weight of one or more diluent excipients and/or from 0 to about 99% by weight of a pharmaceutically active ingredient; B) from about 1 to about 95% by weight of a binder excipient; optionally with, C) from 0 to about 10% by weight of a disintegrant excipient; to heating at a temperature in the range of from about 30 to about 130° C. under the condition of low moisture or low content of a pharmaceutically-acceptable organic solvent in a closed system under mixing by tumble rotation until the formation of granules.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: July 13, 2004
    Assignee: Wei Ming Pharmaceutical Mfg. Co., Ltd.
    Inventors: Ta-Shuong Yeh, Daniel Hungting Yeh
  • Process for the preparation of direct tabletting formulations and aids
    Publication number: 20030017198
    Abstract: A thermal adhesion granulation process for preparing direct tabletting formulations or aids is disclosed.
    Type: Application
    Filed: May 1, 2001
    Publication date: January 23, 2003
    Inventors: Ta-Shuong Yeh, Daniel Hungting Yeh