Patents by Inventor Ta-Wei Tung

Ta-Wei Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming semiconductor device
    Publication number: 20080311715
    Abstract: A method for forming a semiconductor device is disclosed. A substrate comprising trenches are provided. Dopants are doped into a region of the substrate neighboring a sidewall of the trenches by using an isotropic doping method. A gate dielectric layer is formed on the sidewall of the substrate. A gate electrode is formed in the trenches, wherein the gate electrode protrudes a surface of the substrate.
    Type: Application
    Filed: February 8, 2008
    Publication date: December 18, 2008
    Inventors: Po-Kang Hu, Cheng-Che Lee, Ta-Wei Tung, Meng-Cheng Chen
  • Semiconductor device having a composite passivation layer and method of manufacturing the same
    Publication number: 20070298547
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device comprises a fuse bank with a fuse window, a pad area with a pad window, and a composite passivation layer comprising a sacrificial dielectric layer and a final passivation layer. Both the fuse window and the pad window have a bottom portion and two sidewalls, and the composite passivation layer covers both the fuse bank and the pad area except for the bottom portions of the fuse bank and the pad area.
    Type: Application
    Filed: August 28, 2006
    Publication date: December 27, 2007
    Applicant: Promos Technologies Inc.
    Inventors: Po-Kang Hu, Ta-Wei Tung