Patents by Inventor Ta-wei Yang
Ta-wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955890Abstract: A switching converter circuit for switching one end of an inductor therein between plural voltages according to a pulse width modulation (PWM) signal to convert an input voltage to an output voltage. The switching converter circuit has a driver circuit including a high side driver, a low side driver, a high side sensor circuit, and a low side sensor circuit. The high side sensor circuit is configured to sense a gate-source voltage of a high side metal oxide semiconductor field effect transistor (MOSFET), to generate a low side enable signal for enabling the low side driver to switch a low side MOSFET according to the PWM signal. The low side sensor circuit is configured to sense a gate-source voltage of a low side MOSFET, to generate a high side enable signal for enabling the high side driver to switch a high side MOSFET according to the PWM signal.Type: GrantFiled: January 2, 2022Date of Patent: April 9, 2024Assignee: RICHTEK TECHNOLOGY CORPORATIONInventors: Ting-Wei Liao, Chien-Yu Chen, Kun-Huang Yu, Chien-Wei Chiu, Ta-Yung Yang
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Patent number: 10314205Abstract: A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.Type: GrantFiled: September 21, 2017Date of Patent: June 4, 2019Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.Inventor: Ta-Wei Yang
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Publication number: 20190090387Abstract: A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.Type: ApplicationFiled: September 21, 2017Publication date: March 21, 2019Inventor: TA-WEI YANG
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Patent number: 7960258Abstract: The present invention discloses a method for fabricating a nanoscale thermoelectric device, which comprises steps: providing at least one template having a group of nanoscale pores; forming a substrate on the bottom of the template; injecting a molten semiconductor material into the nanoscale pores to form a group of semiconductor nanoscale wires; removing the substrate to obtain a semiconductor nanoscale wire array; and using metallic conductors to cascade at least two semiconductor nanoscale wire arrays to form a thermoelectric device having a higher thermoelectric conversion efficiency.Type: GrantFiled: May 9, 2008Date of Patent: June 14, 2011Assignee: National Chiao Tung UniversityInventors: Chuen-Guang Chao, Jung-Hsuan Chen, Ta-Wei Yang
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Publication number: 20110059568Abstract: The present invention discloses a method for fabricating a nanoscale thermoelectric device, which comprises steps: providing at least one template having a group of nanoscale pores; forming a substrate on the bottom of the template; injecting a molten semiconductor material into the nanoscale pores to form a group of semiconductor nanoscale wires; removing the substrate to obtain a semiconductor nanoscale wire array; and using metallic conductors to cascade at least two semiconductor nanoscale wire arrays to form a thermoelectric device having a higher thermoelectric conversion efficiency.Type: ApplicationFiled: May 9, 2008Publication date: March 10, 2011Inventors: Chuen-Guang CHAO, Jung-Hsuan Chen, Ta-Wei Yang
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Patent number: 7683717Abstract: Fully differential amplifier circuits are described herein that set the common mode voltage as well as reduce the output offset voltage (offset cancellation). A circuit according to one embodiment includes a first section for generating first and second output signals on first and second outputs from first and second input signals, a first negative feedback loop coupled to the first section, and a second negative feedback loop coupled to the first section. A second section controls the first negative feedback loop for adjusting the first output signal towards a common mode voltage level, and for reducing an offset voltage of the first output signal in different loop bandwidths. A third section controls the second negative feedback loop for adjusting the second output signal towards the common mode voltage level, and for reducing an offset voltage of the second output signal in different loop bandwidths.Type: GrantFiled: December 15, 2005Date of Patent: March 23, 2010Assignee: Intelleflex CorporationInventors: Ta-wei Yang, Jyn-Bang Shyu, Robert Olah
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Patent number: 7385448Abstract: a circuit for an RFID device in one embodiment includes an operational amplifier having a first input, a second input, and an output where the first input receives an incoming signal, arid the second input is coupled to the output via a feedback loop. An operational amplifier for an RFID device according to another embodiment compares an output of the operational amplifier to an incoming baseband signal, A circuit according to another embodiment includes an operational amplifier having a first input, a second input, and an output, wherein the first input receives an incoming signal, and wherein the second input is coupled to the output via a feedback loop. A comparator having one input is coupled to the output of the operational amplifier, another input receiving the incoming signal, and an output for outputting an outgoing signal. Methods for adjusting a filtering characteristic of an operational amplifier are also disclosed.Type: GrantFiled: May 17, 2006Date of Patent: June 10, 2008Assignee: Intelleflex CorporationInventors: Ta-wei Yang, Larry Farnsley, Jyn-Bang Shyu, Thomas Ching, Robert Olah
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Publication number: 20080001667Abstract: a circuit for an RFID device in one embodiment includes an operational amplifier having a first input, a second input, and an output where the first input receives an incoming signal, arid the second input is coupled to the output via a feedback loop. An operational amplifier for an RFID device according to another embodiment compares an output of the operational amplifier to an incoming baseband signal, A circuit according to another embodiment includes an operational amplifier having a first input, a second input, and an output, wherein the first input receives an incoming signal, and wherein the second input is coupled to the output via a feedback loop. A comparator having one input is coupled to the output of the operational amplifier, another input receiving the incoming signal, and an output for outputting an outgoing signal. Methods for adjusting a filtering characteristic of an operational amplifier are also disclosed.Type: ApplicationFiled: May 17, 2006Publication date: January 3, 2008Inventors: Ta-wei Yang, Larry Farnsley, Jyn-Bang Shyu, Thomas Ching, Robert Olah
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Publication number: 20070139116Abstract: Fully differential amplifier circuits are described herein that set the common mode voltage as well as reduce the output offset voltage (offset cancellation). A circuit according to one embodiment includes a first section for generating first and second output signals on first and second outputs from first and second input signals, a first negative feedback loop coupled to the first section, and a second negative feedback loop coupled to the first section. A second section controls the first negative feedback loop for adjusting the first output signal towards a common mode voltage level, and for reducing an offset voltage of the first output signal in different loop bandwidths. A third section controls the second negative feedback loop for adjusting the second output signal towards the common mode voltage level, and for reducing an offset voltage of the second output signal in different loop bandwidths.Type: ApplicationFiled: December 15, 2005Publication date: June 21, 2007Inventors: Ta-wei Yang, Jyn-Bang Shyu, Robert Olah