Patents by Inventor Tac Huynh

Tac Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
    Patent number: 6328637
    Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: December 11, 2001
    Assignee: Lam Research Corporation
    Inventors: Michael Labunsky, Tac Huynh, Anthony Meyer, Andrew Nagengast, Glenn W. Travis
  • Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
    Patent number: 6086460
    Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: July 11, 2000
    Assignee: Lam Research Corporation
    Inventors: Michael Labunsky, Tac Huynh, Anthony Meyer, Andrew Nagengast, Glenn W. Travis
  • Method and apparatus for determining the center and orientation of a wafer-like object
    Patent number: 5822213
    Abstract: A device and method for determining the center and orientation of a circular workpiece such as a semiconductor wafer. A laser diode projects a sheet of light onto a linear array of charge coupled devices which measures light intensity as a semiconductor wafer is rotated with its outer periphery intersected by the sheet of light. From a plot of light intensity data versus position at the wafer edge, a derivative of such plot can be calculated to locate an orientation notch or flat in the edge of the wafer. Also, from the plot of light intensity versus edge position it is possible to locate the center of the wafer relative to a rotation axis of a spindle on which the wafer is supported.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: October 13, 1998
    Assignee: Lam Research Corporation
    Inventor: Tac Huynh