Patents by Inventor Tack Loong Low

Tack Loong Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reworking electrical short in ultra sonic bonder
    Patent number: 8096462
    Abstract: A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: January 17, 2012
    Assignee: International Business Machines Corporation
    Inventors: Nia W. Fong, Tack Loong Low
  • METHOD OF REWORKING ELECTRICAL SHORT IN ULTRA SONIC BONDER
    Publication number: 20100276472
    Abstract: A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Nia W. Fong, Tack Loong Low