Abstract: A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.

Abstract: Provided is a display apparatus including a substrate, a plurality of light emitting device (LED) elements arranged in front of the substrate, a transmission layer formed on a front surface of the substrate to entirely cover the plurality of LED elements, a first polarization member arranged in front of the transmission layer, and a second polarization member arranged on a front surface of the first polarization member and allowing external light to be incident thereon, wherein the transmission layer is provided such that polarization of external light polarized through the second polarization member and the first polarization member is maintained in a course of the polarized external light passing through the transmission layer, being reflected by the front surface of the substrate or the plurality of LED elements and being directed to the first polarization member.

Abstract: A display apparatus includes a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules includes: a substrate; a plurality of inorganic light emitting diodes provided on a mounting surface of the substrate; and an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate. The encapsulation layer includes a viscoelastic material having varying viscoelasticity based on temperature being applied to the viscoelastic material.

Abstract: Provided is a display apparatus including a substrate, a plurality of light emitting device (LED) elements arranged in front of the substrate, a transmission layer formed on a front surface of the substrate to entirely cover the plurality of LED elements, a first polarization member arranged in front of the transmission layer, and a second polarization member arranged on a front surface of the first polarization member and allowing external light to be incident thereon, wherein the transmission layer is provided such that polarization of external light polarized through the second polarization member and the first polarization member is maintained in a course of the polarized external light passing through the transmission layer, being reflected by the front surface of the substrate or the plurality of LED elements and being directed to the first polarization member.

Abstract: Various embodiments disclosed herein relates to a fingerprint recognition package and, according to one embodiment, the fingerprint recognition package may comprise: a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. Various other embodiments are also possible.

Abstract: A manufacturing method of a display apparatus includes mounting a plurality of inorganic light emitting diodes on a substrate, forming a black molding layer having a low refractive index and configured to surround the plurality of inorganic light emitting diodes such that front light emitting surfaces of the plurality of inorganic light emitting diodes that are directed to a front side of the display apparatus are exposed, and assembling a plurality of unit modules each comprising the substrate, the plurality of inorganic light emitting diode, and the black molding layer to be adjacent to each other.

Abstract: A display apparatus includes a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules includes: a substrate; a plurality of inorganic light emitting diodes provided on a mounting surface of the substrate; and an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate. The encapsulation layer includes a viscoelastic material having varying viscoelasticity based on temperature being applied to the viscoelastic material.