Patents by Inventor TACKKEUN LEE

TACKKEUN LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9420684
    Abstract: An apparatus for blanking a printed circuit film from a base film, including: an insert member on a lower plate, overlapping a hit region of the base film and including a first pin hole aligned with an auxiliary fixing-hole of the base film an upper plate overlapping the lower plate and movable relative to the lower plate; a puncher protruding from the upper plate and contacting the hit region of the base film; and a fixing-pin protruding from the upper plate and inserted in the auxiliary fixing-hole of the base film and into the first pin hole of the insert member. The base film includes a reference fixing-hole being collinear with a center line of the printed circuit film, and a a plurality of auxiliary fixing-holes separated from the reference fixing-holes at equal intervals along a longitudinal direction of the base film.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: August 16, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: JiHoon Mok, Minill Kim, Sangmyung Byun, Youngil Kim, Tackkeun Lee
  • Publication number: 20120227555
    Abstract: An apparatus for blanking a printed circuit film includes a die unit and a punch unit movable with respect to the die unit. The die unit includes a plate, and an insert member which is on a top surface of the plate and supports a region of a base film which is punched. The insert member supports the base film including a plurality of printed circuit films, and as a punch is lowered, the punch punches the base film and is inserted in an opening of the insert member so as to blank the printed circuit film. The insert member further includes a plurality of assembled detachable frames which define the opening of the insert member.
    Type: Application
    Filed: July 19, 2011
    Publication date: September 13, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: MINILL KIM, SEUNGYU MYUNG, TACKKEUN LEE, NAKHWAN SEONG, SHIN KIM