Abstract: The present disclosure relates to a multilayer protective film that may include a multilayer component and a release liner component underlying the multilayer component. The multilayer component may have a first PET layer overlying a second PET layer. The multilayer protective film may further have a thickness ratio MPFT:RLT of not greater than about 14:1, where MPFT is equal to the thickness of the multilayer component and RLT is equal to the thickness of the release liner component.

Abstract: The present disclosure relates a multilayered film that may include a first PET substrate, and a first anti-microbial coating overlying the first PET substrate. The first anti-microbial coating may include an acrylate-based component, and a silver-based filler component within the acrylate-based component. The first anti-microbial coating may have a MRSA anti-microbial rating of at least about 75%, where the MRSA anti-microbial rating is defined as the percent reduction of methicillin-resistant Staphylococcus aureus (MRSA) activity from an initial inoculation of MRSA on the surface of the anti-microbial layer after 24 hours as measured using ISO22196.

Abstract: The present disclosure relates to a multilayered film that may include a first PET substrate, a first anti-microbial coating overlying the first PET substrate, and a first self-wetting adhesive layer underlying the first PET substrate. The first anti-microbial coating may include a silver-based filler component within the acrylate-based component. The first anti-microbial coating may have a MRSA anti-microbial rating of at least about 75%, where the MRSA anti-microbial rating is defined as the percent reduction of methicillin-resistant Staphylococcus aureus (MRSA) activity from an initial inoculation of MRSA on the surface of the anti-microbial layer after 24 hours as measured using ISO22196.

Abstract: The present disclosure relates to a multilayer protective film that may include a multilayer component and a release liner component underlying the multilayer component. The multilayer component may have a first PET layer overlying a second PET layer. The multilayer protective film may further have a thickness ratio MPFT:RLT of not greater than about 14:1, where MPFT is equal to the thickness of the multilayer component and RLT is equal to the thickness of the release liner component.

Abstract: A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.

Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).