Abstract: An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

Abstract: An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

Abstract: A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 ?m.

Abstract: There is provided a resin sheet that achieves improvement in lightweight, low-profile and high impact characteristics, suppresses thermal shrinkage and expansion and is excellent in light transparency so as to prevent the display quality or the like of a display device from being deteriorated, as well as a substrate for a display device, a display device and a substrate for a solar cell, each having the aforesaid resin sheet. A resin sheet includes a cured resin layer containing in a resin a glass fiber cloth-like material and inorganic particles, and is structured to have a haze value of 10% or lower.

Abstract: In the present invention, there is provided a laminated film that is excellent in terms of mechanical strength and low coefficient of thermal expansion. According to the present invention, there is provided a laminated film, which is characterized in that it comprises a resin sheet having a cured resin layer containing glass cloth and a polarizing plate laminated on the resin sheet, in which any one of weft yarn and warp yarn of the glass cloth is oriented at an angle of 5 degrees or less relative to an absorption axis of the polarizing plate.

Abstract: There is provided a resin sheet that achieves improvement in lightweight, low-profile and high impact characteristics, suppresses thermal shrinkage and expansion and is excellent in light transparency so as to prevent the display quality or the like of a display device from being deteriorated, as well as a substrate for a display device, a display device and a substrate for a solar cell, each having the aforesaid resin sheet. A resin sheet includes a cured resin layer containing a glass fiber cloth-like material and an overcoat layer laminated on the cured resin layer to have a surface roughness Rt of 200 nm or less, and is structured to have a haze value of 10% or lower.

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25° C. and 5,000 poise or less at 80° C.

Abstract: A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 ?m.

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.

Abstract: A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25° C. or has a viscosity of not less than 400 Pa·s at 25° C. and of not more than 200 Pa·s at 80° C.; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition.

Abstract: A composition useful as an encapsulating material for photosemiconductor elements such as a photodetector or light emmitor comprises an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2):CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --Y.sub.1 (1)[CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --RCOO--].sub.m --Y.sub.2(2)wherein Y.sub.1 represents --H, --RCOOH, --COR' or --R'; R' is an alkyl group with not more than 30 carbon atoms; R is a divalent organic group; Y.sub.2 represents a metal atom having a valence of at least one; the mean value for x is from 8-200; and n is set such that the weight ratio of the repeating unit --CH.sub.2 --CH.sub.2 --O-- accounts for from 25-95% by weight based on the whole compound; and m is a positive integer corresponding to the valence of Y.sub.2.

Abstract: A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):(A) the refractive index difference X between refractive index values (b) and (c), which respectively are lower and higher than refractive index value (a) corresponding to the maximum peak of the refractive index distribution curve and respectively correspond to those points on the refractive index distribution curve which have a relative height of 20 with the height of the maximum peak being taken as 100, is 0.