Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.

Abstract: A light emitting device includes: a rectangular substrate, a light emitting element, a reflective member disposed at one or more lateral sides of the light emitting element while being away from therefrom, a light guide member, and a light transmissive member on the light guide member. The reflective member includes one or more first reflective members opposing lateral faces of the light emitting element, and a second reflective member outside the first reflective member. The first reflective members have inner lateral faces opposing each other each having an oblique or curved portion slanted so that a distance therebetween increases towards the light transmissive member from a side close to the substrate. The second reflective member covers outer lateral faces of the light transmissive member and the first reflective members, and an upper face of the second reflective member is flush with an upper face of the light transmissive member.

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

Abstract: A light-emitting device includes a mounting board, a first light-emitting element, a second light-emitting element and a light-reflective covering member. The mounting board includes first lands and second lands on an upper surface of the mounting board. The first light-emitting element is flip-chip mounted on the first lands. The second light-emitting element is flip-chip mounted on the second lands. The light-reflective covering member covers a lateral surface of the first light-emitting element, a lateral surface of the second light-emitting element, and the upper surface of the mounting board. The mounting board and the light-reflective covering member define a depressed portion between the first light-emitting element and the second light-emitting element with a bottom surface of the depressed portion being located inside the mounting board.

Abstract: A light emitting device includes a mounting board, first and second light emitting elements and a light reflective covering member. The mounting board includes an insulating base, first and second lands arranged, and an intermediate part arranged between the first and second lands. The first and second light emitting elements are flip-chip mounted on the first and second lands, respectively. The light reflective covering member is provided above the intermediate part and covers lateral surfaces of the first and second light emitting elements. The light reflective covering member defines a recess part arranged above the intermediate part with a bottom of the recess part being positioned below top surfaces of the first and second light emitting elements and above the top surface of the intermediate part, and a surface of the light reflective covering member defining the recess part constitutes a part of an outer surface of the light emitting device.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a substrate, and a light reflective covering member. A first land is provided in a substrate front surface and includes a first terminal and a second terminal. A second land is provided in the substrate front surface and includes a third terminal and a fourth terminal. An intermediate wiring is provided between the first land and the second land in the substrate front surface. A first wiring is provided in a substrate back surface and is electrically connected to the first terminal through a first through-via. A second wiring is provided in the substrate back surface and is electrically connected to the fourth terminal through a second through-via. A third wiring is provided in the substrate back surface and is electrically connected to the second terminal and the third terminal through a third through-via.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a substrate, and a light reflective covering member. A first land is provided in a substrate front surface and includes a first terminal and a second terminal. A second land is provided in the substrate front surface and includes a third terminal and a fourth terminal. An intermediate wiring is provided between the first land and the second land in the substrate front surface. A first wiring is provided in a substrate back surface and is electrically connected to the first terminal through a first through-via. A second wiring is provided in the substrate back surface and is electrically connected to the fourth terminal through a second through-via. A third wiring is provided in the substrate back surface and is electrically connected to the second terminal and the third terminal through a third through-via.

Abstract: A light-emitting device includes a substrate having a first surface extended in a first direction, a second surface opposite to the first surface, a third surface between the first and second surfaces and extended in the first direction, and a fourth surface opposite to the third surface, a conductive member including at least four element mounting portions arranged in the first direction on the first surface, a first wiring portion on the second surface, a second wiring portion on the third surface, and a third wiring portion on the fourth surface, and first, second, third, and fourth light-emitting elements respectively mounted on the four element mounting portions. With the first, second, and third wiring portions, the first and second light-emitting elements are connected in series, the third and fourth light-emitting elements are connected in series, and the first and third light-emitting elements are connected in parallel.

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Abstract: A light emitting device includes a first light emitting element having a first front surface and a first lateral surface, and a second light emitting element having a second front surface and a second lateral surface. A substrate includes a substrate front surface in which an intermediate wiring is provided. The light reflective covering member is provided on the substrate front surface to cover the first lateral surface and the second lateral surface. The light reflective covering member includes an external surface opposite to a substrate front surface in the front-back direction and a first recess having a recess opening on the external surface and a recess bottom opposite to the recess opening in the front-back direction. The recess bottom is positioned between the intermediate wiring and both of the first front surface and the second front surface in the front-back direction.

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Abstract: A light emitting device includes a first light emitting element having a first front surface and a first lateral surface, and a second light emitting element having a second front surface and a second lateral surface. A substrate includes a substrate front surface in which an intermediate wiring is provided. The light reflective covering member is provided on the substrate front surface to cover the first lateral surface and the second lateral surface. The light reflective covering member includes an external surface opposite to a substrate front surface in the front-back direction and a first recess having a recess opening on the external surface and a recess bottom opposite to the recess opening in the front-back direction. The recess bottom is positioned between the intermediate wiring and both of the first front surface and the second front surface in the front-back direction.

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.

Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.

Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Abstract: A light-emitting device includes a substrate having a first surface extended in a first direction, a second surface opposite to the first surface, a third surface between the first and second surfaces and extended in the first direction, and a fourth surface opposite to the third surface, a conductive member including at least four element mounting portions arranged in the first direction on the first surface, a first wiring portion on the second surface, a second wiring portion on the third surface, and a third wiring portion on the fourth surface, and first, second, third, and fourth light-emitting elements respectively mounted on the four element mounting portions. With the first, second, and third wiring portions, the first and second light-emitting elements are connected in series, the third and fourth light-emitting elements are connected in series, and the first and third light-emitting elements are connected in parallel.

Abstract: The method for manufacturing the semiconductor light emitting device includes steps of forming a plurality of semiconductor light emitting element regions on a substrate, forming a recess portion between the plurality of semiconductor light emitting element regions on a surface of the substrate, disposing a light reflective sealing resin on the substrate to cover the plurality of semiconductor light emitting element regions with the sealing resin and to fill the recess portion with a part of the sealing resin that covers the plurality of semiconductor light emitting element regions, removing the substrate, disposing a light transmissive resin on surfaces of the plurality of semiconductor light emitting element regions where the substrate has been removed, and dividing the plurality of semiconductor light emitting element regions into individual pieces, wherein the recess portion includes a first recess portion and one or more second recess portions shallower than the first recess portion.

Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.