Patents by Inventor Tadaaki Ono

Tadaaki Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrode structure of a semiconductor device which uses a copper wire as a bonding wire
    Patent number: 5293073
    Abstract: A semiconductor device comprises a semiconductor substrate, a first insulation film formed on the semiconductor substrate, a metal film for forming a bonding pad on the first insulation film, and a second insulation film which is formed between the first insulation film and the bonding pad and which is stiffer than the first insulation film.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: March 8, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tadaaki Ono