Patents by Inventor Tadaaki Yamamoto

Tadaaki Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8486234
    Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: July 16, 2013
    Assignee: Ebara Corporation
    Inventors: Nobutoshi Saito, Jumpei Fujikata, Tadaaki Yamamoto, Kenji Kamimura
  • Publication number: 20120193220
    Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
    Type: Application
    Filed: April 10, 2012
    Publication date: August 2, 2012
    Inventors: Nobutoshi SAITO, Jumpei Fujikata, Tadaaki Yamamoto, Kenji Kamimura
  • Patent number: 8177944
    Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: May 15, 2012
    Assignee: Ebara Corporation
    Inventors: Nobutoshi Saito, Jumpei Fujikata, Tadaaki Yamamoto, Kenji Kamimura
  • Publication number: 20090139871
    Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 4, 2009
    Inventors: Nobutoshi Saito, Jumpei Fujikata, Tadaaki Yamamoto, Kenji Kamimura
  • Patent number: 4717697
    Abstract: A method of regenerating hydrous zeolite which contains acetone as well as water after having been used to dehydrate hydrous acetone of the invention which comprises: placing the hydrous zeolite in a closed system in which a heated inert gas is circulated at a pressure more than atmospheric pressures to bring the inert gas into contact with the hydrous zeolite to remove the acetone and water from the zeolite, and condensing the acetone and water in the closed system and removes them from the closed system.The method is in particular useful for regenerating hydrous zeolite which has been used to dehydrate hydrous acetone resulting from the reaction of L-sorbose with acetone to produce diacetone-L-sorbose, and which thus contains acetone as well as about 1000-4000 ppm of water therein.
    Type: Grant
    Filed: July 8, 1986
    Date of Patent: January 5, 1988
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Kiyomitsu Kunugiza, Tadaaki Yamamoto, Hitoshi Sawada
  • Patent number: 3988067
    Abstract: In an automatic polarization analyzing device which employs the extinction detecting method using a light amplitude modulating system, two sets of converter means are provided for converting into an angle a positional deviation electrical signal corresponding to a dead zone present in the control system.
    Type: Grant
    Filed: February 4, 1975
    Date of Patent: October 26, 1976
    Assignee: Nippon Kogaku K.K.
    Inventors: Tadaaki Yamamoto, Toshiyuki Kasai, Yoshihiro Kaizawa, Sakuji Watanabe
  • Patent number: RE45687
    Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: September 29, 2015
    Assignee: EBARA CORPORATION
    Inventors: Nobutoshi Saito, Jumpei Fujikata, Tadaaki Yamamoto, Kenji Kamimura