Abstract: A hybrid IC with a heat sink includes a conductive substrate, a heat sink, an insulating sheet, a plurality of terminals, a power-consuming component, and a resin. The heat sink is separated from the conductive substrate. The insulating sheet is arranged on the conductive substrate. Electric components, wiring conductors, and connecting electrodes are arranged on a surface of the insulating sheet. The terminals are connected to the connecting electrodes on the insulating sheet. The power-consuming component is disposed on the heat sink to be connected to the wiring conductors on the insulating sheet through bonding wires. The resin seals the insulating sheet and a portion of the heat sink on which the power-consuming component is disposed.