Patents by Inventor Tadahiko Hirakawa
Tadahiko Hirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9299874Abstract: A coating apparatus including a coating part which has a nozzle which ejects a liquid material including an oxidizable metal from a tip portion, and a relative driving unit which moves a substrate and the nozzle in relation to each other so that the tip portion passes through the substrate, such that at least the tip portion of the nozzle provides an affinity control part which is formed so that affinity between the affinity control part and the liquid material is less than that between the liquid materials.Type: GrantFiled: October 12, 2011Date of Patent: March 29, 2016Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tadahiko Hirakawa, Koichi Misumi
-
Patent number: 9186696Abstract: A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate, a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the substrate is transported, and a removal unit which removes the liquid material from the inside of the chamber when at least one of oxygen concentration and humidity inside the chamber exceeds a threshold value.Type: GrantFiled: September 2, 2010Date of Patent: November 17, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hidenori Miyamoto, Kenji Maruyama, Tadahiko Hirakawa, Koichi Misumi
-
Publication number: 20130280844Abstract: A coating apparatus including a coating part which has a nozzle which ejects a liquid material including an oxidizable metal from a tip portion, and a relative driving unit which moves a substrate and the nozzle in relation to each other so that the tip portion passes through the substrate, such that at least the tip portion of the nozzle provides an affinity control part which is formed so that affinity between the affinity control part and the liquid material is less than that between the liquid materials.Type: ApplicationFiled: October 12, 2011Publication date: October 24, 2013Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tadahiko Hirakawa, Koichi Misumi
-
Patent number: 8485126Abstract: A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating section in which the coating part applies the liquid material on the substrate and a transport section into which the liquid material is transported; an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber; and a control part which stops an operation of the coating part in response to the entrance of foreign object into the chamber.Type: GrantFiled: September 1, 2010Date of Patent: July 16, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hidenori Miyamoto, Kenji Maruyama, Tadahiko Hirakawa, Koichi Misumi
-
Publication number: 20110059250Abstract: A coating method including coating a liquid material including an oxidizable metal on a substrate a plurality of times to laminate a plurality of liquid material layers on the substrate; and adjusting at least one of oxygen concentration and humidity inside a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported.Type: ApplicationFiled: September 1, 2010Publication date: March 10, 2011Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori MIYAMOTO, Kenji MARUYAMA, Tadahiko HIRAKAWA, Koichi MISUMI
-
Publication number: 20110059245Abstract: A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate, a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the substrate is transported, and a removal unit which removes the liquid material from the inside of the chamber when at least one of oxygen concentration and humidity inside the chamber exceeds a threshold value.Type: ApplicationFiled: September 2, 2010Publication date: March 10, 2011Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori MIYAMOTO, Kenji MARUYAMA, Tadahiko HIRAKAWA, Koichi MISUMI
-
Publication number: 20110059248Abstract: A coating method including coating a liquid material including an oxidizable metal on a substrate, and heating the substrate having the liquid material coated thereon in the presence of an inert gas.Type: ApplicationFiled: August 30, 2010Publication date: March 10, 2011Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori MIYAMOTO, Kenji MARUYAMA, Tadahiko HIRAKAWA, Koichi MISUMI
-
Publication number: 20110059246Abstract: A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported; and an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber.Type: ApplicationFiled: September 3, 2010Publication date: March 10, 2011Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori MIYAMOTO, Kenji MARUYAMA, Tadahiko HIRAKAWA, Koichi MISUMI
-
Publication number: 20110059574Abstract: A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating section in which the coating part applies the liquid material on the substrate and a transport section into which the liquid material is transported; an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber; and a control part which stops an operation of the coating part in response to the entrance of foreign object into the chamber.Type: ApplicationFiled: September 1, 2010Publication date: March 10, 2011Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Kenji Maruyama, Tadahiko Hirakawa, Koichi Misumi
-
Patent number: 7642530Abstract: An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.Type: GrantFiled: March 2, 2007Date of Patent: January 5, 2010Assignees: Kabushiki Kaisha Toshiba, ULVAC, Inc., Sanyo Electric Co., Ltd., Sony CorporationInventors: Takeshi Shibata, Hiroshi Hashimoto, Tadahiko Hirakawa, Kazuhiko Tonari
-
Publication number: 20070152173Abstract: An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.Type: ApplicationFiled: March 2, 2007Publication date: July 5, 2007Inventors: Takeshi Shibata, Hiroshi Hashimoto, Tadahiko Hirakawa, Kazuhiko Tonari
-
Patent number: 7227159Abstract: An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.Type: GrantFiled: September 28, 2004Date of Patent: June 5, 2007Assignees: Kabushiki Kaisha Toshiba, ULVAC, Inc., Sanyo Electric Co., Ltd., Sony CorporationInventors: Takeshi Shibata, Hiroshi Hashimoto, Tadahiko Hirakawa, Kazuhiko Tonari
-
Publication number: 20050211924Abstract: An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.Type: ApplicationFiled: September 28, 2004Publication date: September 29, 2005Inventors: Takeshi Shibata, Hiroshi Hashimoto, Tadahiko Hirakawa, Kazuhiko Tonari
-
Publication number: 20050100801Abstract: To provide a stencil mask that the heat generated in the surface of the stencil mask can be radiated to a supporting substrate supporting a portion around the edge of a thin film quickly and a method of producing the same. A stencil mask has a thin film having an aperture pattern and a supporting substrate supporting a portion around the edge of a thin film and a method of producing the same, and a stencil mask and the method of producing the same has an aspect that a plug that having heat conductance higher than that of a thin film and a supporting substrate is embedded in a state of contacting a thin film and reaches inside of a supporting substrate.Type: ApplicationFiled: November 9, 2004Publication date: May 12, 2005Applicants: Sony Corporation, Rohm Co., Ltd.Inventors: Tadahiko Hirakawa, Hiroshi Kumano
-
Publication number: 20050100800Abstract: To provide a stencil mask that contamination generating because a material layer set in the surface of a stencil mask is sputtered by a charged particle beam can be-prevented and a method of producing the same. A stencil mask has a thin film having an aperture pattern and a method of producing the same, and a stencil mask and the method of producing the same has an aspect that a material layer having heat conductance higher than that of a thin film is set in the region except for a portion of outer edge of the aperture pattern in the side of a principal surface of a thin film.Type: ApplicationFiled: November 9, 2004Publication date: May 12, 2005Applicants: Sony Corporation, Rohm Co., Ltd.Inventors: Tadahiko Hirakawa, Hiroshi Kumano