Patents by Inventor Tadahiko Sakai

Tadahiko Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5516032
    Abstract: The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.
    Type: Grant
    Filed: November 16, 1994
    Date of Patent: May 14, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shoji Sakemi, Tadahiko Sakai
  • Patent number: 5447267
    Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond, is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: September 5, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadahiko Sakai, Shinichi Kuroki
  • Patent number: 5428505
    Abstract: A printed circuit board comprising a plurality of lands onto which a plurality of leads of an electronic component are soldered. These lands are arrayed in parallel one another. Each of these lands includes a narrow portion basically extending in a longitudinal direction thereof and having a predetermined constant width, and a wide portion protruding laterally from both edges of the narrow portion.
    Type: Grant
    Filed: August 5, 1994
    Date of Patent: June 27, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shouzi Sakemi, Tadahiko Sakai