Abstract: A semiconductor module, including a metal-oxide-semiconductor field effect transistor (MOSFET) made of a SiC semiconductor material, and an insulated gate bipolar transistor (IGBT) that is made of a Si semiconductor material and is connected in parallel with the MOSFET. The MOSFET having a body diode. The IGBT is a reverse conductive-IGBT (RC-IGBT), and includes a free wheeling diode. A forward voltage of the free wheeling diode is so set that a current in the body diode of the MOSFET, which is connected in parallel with the RC-IGBT, is equal to or below a current value that causes lattice defects to grow in the MOSFET.

Abstract: A terminal structure includes a pair of plate sections including first and second plate sections respectively provided spaced apart from each other in a thickness direction of the nut, a connection plate section extending in the thickness direction of the nut and connects respective one ends of the pair of plate sections to each other, a terminal section protruding from the other end of the first plate section of the pair of plate sections and faces the connection plate section, and a holding section provided at at least one of the connection plate section or the terminal section, and restricting rotation of the nut and movement of the nut in a direction intersecting the thickness direction. The pair of plate sections, the connection plate section, the terminal section, and the holding section are constituted by one plate-shaped body.

Abstract: A semiconductor module includes a multilayer substrate having a main wiring layer formed therein, a main current flowing in the main wiring layer when the semiconductor device is turned on, a first and second semiconductor elements, each of which has a top electrode on a top surface thereof and a bottom electrode on a bottom surface thereof, and is disposed on a top surface of the main wiring layer to which the bottom electrode is conductively connected, a metal plate having an end portion, a bottom surface of the end portion being conductively connected to the top electrode of the first semiconductor element, and a control board including an insulating plate disposed on the top surface of the end portion and a control wiring layer disposed on a top surface of the insulating plate for controlling turning on and off of the first and second semiconductor elements.

Abstract: A semiconductor apparatus includes: a base, an insulating substrate arranged on the base, a semiconductor element arranged on the insulating substrate, a case joined to the base and housing the semiconductor element, and a sealing material supplied in the case. The case includes a terminal block that extends in a first direction from an inner wall surface of the case. The terminal block is arranged thereon a terminal that is electrically connected to the semiconductor element via a wiring member. The terminal block includes a projecting portion that extends, in plan view, in the first direction from a first position of a distal end portion of the terminal to a second position. A first distance between the first position and the second position is at least 1 mm.

Abstract: A semiconductor module includes a laminate substrate including an insulating plate and first and second circuit boards on an upper surface of the insulating plate, the first semiconductor device on an upper surface of the first circuit board, a first main terminal, and a first metal wiring board that electrically connects the first semiconductor device to the first main terminal. The first metal wiring board has a first bonding section bonded to an upper surface electrode of the first semiconductor device, a second bonding section bonded to an upper surface of the second circuit board, a first coupling section that couples the first bonding section to the second bonding section, a first raised section that rises upward from an end portion of the second bonding section. The first raised section has an upper end that is electrically connected to the first main terminal.

Abstract: A semiconductor module includes: a semiconductor chip including a main electrode; a connection conductor electrically connected to the main electrode; a housing portion surrounding the semiconductor chip and at least a part of the connection conductor; a sealing material filled in a space surrounded by the housing portion; and a connection unit fixed to the housing portion. The conductive portion, which is a part of the connection conductor, is exposed from a surface of the sealing material. The connection unit includes: a connection terminal joined to the conductive portion of the connection conductor; and a support that is formed separately from the housing portion and supports the connection terminal.

Abstract: A semiconductor module includes a multilayer substrate having a main wiring layer formed therein, a main current flowing in the main wiring layer when the semiconductor device is turned on, a first and second semiconductor elements, each of which has a top electrode on a top surface thereof and a bottom electrode on a bottom surface thereof, and is disposed on a top surface of the main wiring layer to which the bottom electrode is conductively connected, a metal plate having an end portion, a bottom surface of the end portion being conductively connected to the top electrode of the first semiconductor element, and a control board including an insulating plate disposed on the top surface of the end portion and a control wiring layer disposed on a top surface of the insulating plate for controlling turning on and off of the first and second semiconductor elements.

Abstract: A semiconductor module includes an insulating sheet which has a first surface and extends in a first direction and a first terminal. The first terminal has a first region disposed on the first surface of the insulating sheet and having a first width in a second direction perpendicular to the first direction, a second region extending from the first region and having a second width in the second direction narrower than the first width, and a third region located away from the first surface and being electrically connected to both the first region and the second region.

Abstract: An imaging apparatus for an endoscope includes: a lens; an image sensor configured to capture an image via the lens; a light blocking portion provided covering the lens and the image sensor; a light source provided near the light blocking portion; and a light guide portion provided covering the light blocking portion and the light source and configured to guide light from the light source. The light blocking portion is provided so as to prevent the light from the light source from being incident on the lens and the image sensor. An end face of the lens is arranged at a position further recessed than at least an end face of the light blocking portion.

Abstract: A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

Abstract: A semiconductor module includes first and second semiconductor chips including first and second main electrodes, respectively; first and second connection terminals electrically connected to the first and second main electrodes, respectively; and an insulating sheet. The first connection terminal includes a first conductor portion including a first peripheral edge and a first terminal portion extending from the first peripheral edge in plan view, and the second connection terminal includes a second conductor portion including a second peripheral edge. A part of the first conductor portion overlap a part of the second conductor portion in plan view. The insulating sheet includes an insulating portion layered between the first and second conductor portions, and a first protruding portion positioned between a tip portion of the first terminal portion and the second peripheral edge in plan view, the first protruding portion forming an angle relative to a surface of the first terminal portion.

Abstract: A power semiconductor module including at least first and second power semiconductor elements, includes a first terminal, a first gate terminal, a second terminal, a second gate terminal, a third terminal and a common terminal. The first terminal connected to a first electrode of the first power semiconductor element. The first gate terminal connected to a gate of the first power semiconductor element. The second terminal connected to a first electrode of the second power semiconductor element. The second gate terminal connected to a gate of the second power semiconductor element. The third terminal connected to a second electrode of the first power semiconductor element and a second electrode of the second power semiconductor element. The common terminal that is connected to the first gate terminal through a first resistor and is connected to the second gate terminal through a second resistor.

Abstract: An electronic circuit, including a first switching device that contains a first semiconductor material with a first band gap, and a second switching device that is coupled in parallel to the first switching device, and contains a second semiconductor material with a second band gap smaller than the first band gap. Each of the first and second switching devices has a control electrode, and the control electrode of the first switching device is coupled to the control electrode of the second switching device.

Abstract: Provided is a switching apparatus and a determination apparatus connected to the switching apparatus. The switching apparatus comprises: a first switching device and a second switching device, wherein each first main terminal is connected to a first reference potential; an opposing switching device, wherein a second main terminal is connected to a second reference potential; an output wiring section; a first detector for detecting a first detection value changing in accordance with current flowing in the first switching device; and a second detector for detecting a second detection value changing in accordance with current flowing in the second switching device.

Abstract: A semiconductor module includes a multilayer substrate having an insulating plate on which first to third conductive layers respectively connected to positive, negative and output electrode terminals are arranged in a first direction, a plurality of first semiconductor elements each having top and bottom electrodes on the first conductive layer and arranged in a second direction orthogonal to the first direction, a plurality of second semiconductor elements each having top and bottom electrodes on the second conductive layer and arranged in the second direction, first and second main wiring members each connecting the top electrode of each first and second semiconductor element to the second and third conductive layers. The multilayer substrate includes a first control wiring layer extending in the second direction and passing under the first main wiring member, and a second control wiring layer extending in the second direction and passing under the second main wiring member.

Abstract: An in-vivo camera device and an in-vivo monitoring camera system more excellent in usability are proposed. An in-vivo camera device includes a camera unit introduced into a body, a support member, and a camera-side cable. The support member has a trocar connection portion for connection with a trocar at a front end side, and is connected to the trocar in a state in which the trocar connection portion is fitted into the trocar by applying tensile force to the camera-side cable passing through the trocar. The support member is provided with a guide introduction portion that is formed to be relatively long at the front end side as a stabilization structure for stabilizing connection with the trocar.

Abstract: Provided is a switching apparatus and a determination apparatus connected to the switching apparatus. The switching apparatus comprises: a first switching device and a second switching device, wherein each first main terminal is connected to a first reference potential; an opposing switching device, wherein a second main terminal is connected to a second reference potential; an output wiring section; a first detector for detecting a first detection value changing in accordance with current flowing in the first switching device; and a second detector for detecting a second detection value changing in accordance with current flowing in the second switching device.

Abstract: An electronic circuit, including a first switching device that contains a first semiconductor material with a first band gap, and a second switching device that is coupled in parallel to the first switching device, and contains a second semiconductor material with a second band gap smaller than the first band gap. Each of the first and second switching devices has a control electrode, and the control electrode of the first switching device is coupled to the control electrode of the second switching device.

Abstract: A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

Abstract: A semiconductor module includes a multilayer substrate having an insulating plate on which first to third conductive layers respectively connected to positive, negative and output electrode terminals are arranged in a first direction, a plurality of first semiconductor elements each having top and bottom electrodes on the first conductive layer and arranged in a second direction orthogonal to the first direction, a plurality of second semiconductor elements each having top and bottom electrodes on the second conductive layer and arranged in the second direction, first and second main wiring members each connecting the top electrode of each first and second semiconductor element to the second and third conductive layers. The multilayer substrate includes a first control wiring layer extending in the second direction and passing under the first main wiring member, and a second control wiring layer extending in the second direction and passing under the second main wiring member.