Abstract: An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) at least one plasticizer selected from the group consisting of compounds represented by the following formula (1): R1O—R2mOOC—(CH2nCOOR3—OmR4??(1) wherein R1 and R4are the same or different alkyl groups having 1 to 30 carbon atoms or alkenyl groups, R2 and R3 are the same or different alkylene groups having 1 to 30 carbon atoms or alkenylene groups, m is an integer of 0 to 5, and n is an integer of 1 to 10, and compounds represented by the following formula (2): wherein R5 is an alkyl group having 1 to 30 carbon atoms or alkenyl group. A transfer film and a plasma display panel production process using the composition are also described.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) at least one plasticizer selected from the group consisting of compounds represented by the following formula (1): R1&Parenopenst;O—R2&Parenclosest;mOOC—(CH2&Parenclosest;nCOO&Parenopenst;R3—O&Parenclosest;mR4  (1) wherein R1 and R4 are the same or different alkyl groups having 1 to 30 carbon atoms or alkenyl groups, R2 and R3 are the same or different alkylene groups having 1 to 30 carbon atoms or alkenylene groups, m is an integer of 0 to 5, and n is an integer of 1 to 10, and compounds represented by the following formula (2): wherein R5 is an alkyl group having 1 to 30 carbon atoms or alkenyl group. A transfer film and a plasma display panel production process using the composition are also described.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: An inorganic particle-containing composition comprising:

Abstract: An inorganic particle-containing composition comprising:

Abstract: An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) at least one plasticizer selected from the group consisting of compounds represented by the following formula (1): R1&Parenopenst;O—R2&Parenclosest;mOOC&Parenopenst;CH2&Parenclosest;nCOO&Parenopenst;R3—O&Parenclosest;mR4  (1)  wherein R1 and R4 are the same or different alkyl groups having 1 to 30 carbon atoms or alkenyl groups, R2 and R3 are the same or different alkylene groups having 1 to 30 carbon atoms or alkenylene groups, m is an integer of 0 to 5, and n is an integer of 1 to 10, and compounds represented by the following formula (2):  wherein R5 is an alkyl group having 1 to 30 carbon atoms or alkenyl group. A transfer film and a plasma display panel production process using the composition are also described.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: A radiation sensitive composition comprising (1) a phosphor; (2) an organic polymer binder comprising a combination of at least one alkali-soluble resin and at least one cellulose ether; (3) a photo-crosslinkable compound; and (4) a photo-radical generating agent.

Abstract: A glass paste composition contains:(A) glass powders (B) a binder resin; and (C) at least one organic solvent selected from a ketone, an alcohol and an ester which has property that the normal boiling point is 100 to 200.degree. C., and the vapor pressure at 20.degree. C. is 0.5 to 50 mmHg.A plasma display panel is produced by a method which comprisescoating the glass paste composition on a base film to form a film forming material layer;transferring the film forming material layer formed on the base film to a glass substrate; andbaking the transferred film forming material layer to form a dielectric layer on the surface of the glass substrate.

Abstract: Disclosed is a process for manufacturing a plasma display panel comprising a novel forming step in which a very thick dielectric layer can be formed in an efficient manner. The process for manufacturing a plasma display panel comprising a step of transferring a coating material layer formed on a support film to the surface of a glass substrate to which an electrode is secured; and a step of baking the transferred coating material layer to form a dielectric layer on the surface of the glass substrate.

Abstract: A radiation sensitive composition containing a fluorescent substance dispersed therein, comprising (A) the fluorescent substance, (B) an organic polymer binder, (C) at least one optically crosslinkable compound selected from optically crosslinkable monomers and oligomers, and (D) an optically radical-generating agent which comprises (a) a 2,4,5-triaryl imidazole dimer, (b) an amino group-containing benzophenone photosensitizer, and (c) a thiol compound represented by the following formula (1): ##STR1## wherein Z is --O--, --S--, --NH-- or --CONH--. This radiation sensitive composition can provide a fluorescent screen having a larger film thickness and a higher display brightness and hence, will greatly contribute to increases in the size and precision of a fluorescent display device such as a plasma display panel.