Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to a process (1) comprising treatment with an alkali metal hydroxide solution, a process (2) comprising treatment with an alkaline aqueous solution containing an aliphatic amine, a process (3) comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, a process (4) comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and a process (5) comprising copper electroplating, which are implemented sequentially.

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.

Abstract: In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.

Abstract: A method of manufacture is provided in which position deviations during mounting are eliminated, and in which fine connections on the order of a 30 ?m pitch can be stabilized. A low cost device can thus be realized by cost reductions that accompany smaller ICs. Mounting is performed in a state where moisture in a polyimide film of a film substrate has been substantially dried, or mounting is performed after conditioning under a fixed environment. Further, patterning of the film substrate is performed after similar drying processing or conditioning.

Abstract: An object of the present invention is to provide a switching mechanism of an ejector which is simple to operate and in which projecting portions on a gun are minimized. A hammer is pivoted to return to the original position when a breech is opened after a gun is fired, whereby a projection of the hammer abuts against a head of a trip rod. Thus, the trip rod is shifted longitudinally and the ejector mechanism is operated. A spiral guide which is engaged with the trip rod is formed on a selector button adjacent to the trip rod, and a groove for rotation is formed on an end surface of the selector button. When the selector button is rotated, the trip rod is shifted in the direction which intersects with its longitudinal direction, thereby switching between a state in which the projection abuts against the head and another state in which they are not abutted against each other.