Patents by Inventor Tadahiro Yokozawa
Tadahiro Yokozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10149394Abstract: A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t?T?5t.Type: GrantFiled: January 21, 2015Date of Patent: December 4, 2018Assignee: UBE INDUSTRIES, LTD.Inventors: Toru Miura, Keita Bamba, Masafumi Kohda, Tadahiro Yokozawa
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Publication number: 20160353580Abstract: A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t?T?5t.Type: ApplicationFiled: January 21, 2015Publication date: December 1, 2016Applicant: UBE Industries, Ltd.Inventors: Toru MIURA, Keita BAMBA, Masafumi KOHDA, Tadahiro YOKOZAWA
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Publication number: 20150069012Abstract: A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.Type: ApplicationFiled: November 14, 2014Publication date: March 12, 2015Inventors: Hiroaki Yamaguchi, Tadahiro Yokozawa, Shuichi Maeda
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Publication number: 20120308816Abstract: Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.Type: ApplicationFiled: February 10, 2011Publication date: December 6, 2012Applicant: UBE INDUSTRIES, LTD.Inventors: Shin-ichiro Kohama, Nobuharu Hisano, Hiroaki Yamaguchi, Yoshiyuki Oishi, Toru Miura, Tadahiro Yokozawa, Masafumi Kohda, Kosuke Oishi
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Publication number: 20120288621Abstract: A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.Type: ApplicationFiled: July 25, 2012Publication date: November 15, 2012Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroaki Yamaguchi, Tadahiro Yokozawa, Shuichi Maeda
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Patent number: 7918021Abstract: A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.Type: GrantFiled: July 9, 2008Date of Patent: April 5, 2011Assignee: Ube Industries, Ltd.Inventors: Ryuichiro Kogure, Tadahiro Yokozawa, Hiroaki Yamaguchi, Osamu Nakayama
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Publication number: 20100252309Abstract: The polyimide film of the present invention is to be used for the production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.Type: ApplicationFiled: July 25, 2008Publication date: October 7, 2010Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroaki Yamaguchi, Tadahiro Yokozawa, Shuichi Maeda
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Publication number: 20100230142Abstract: Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing.Type: ApplicationFiled: October 23, 2008Publication date: September 16, 2010Applicant: UBE INDUSTRIES, LTD.Inventors: Keita Bamba, Tadahiro Yokozawa, Hideaki Watanabe
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Publication number: 20090266589Abstract: Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.Type: ApplicationFiled: October 13, 2006Publication date: October 29, 2009Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Nobu Iizumi, keita Bamba, Tadahiro Yokozawa
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Publication number: 20090242411Abstract: A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.Type: ApplicationFiled: May 14, 2009Publication date: October 1, 2009Applicant: Ube Industries, Ltd,Inventors: Tadahiro Yokozawa, Hiroaki Yamaguchi, Keita Banba, Masao Okubo, Sumiko Okubo
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Publication number: 20090211786Abstract: Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin.Type: ApplicationFiled: October 13, 2006Publication date: August 27, 2009Inventors: Keita Bamba, Tadahiro Yokozawa, Hiroto Shimokawa, Nobu Iizumi
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Publication number: 20090002953Abstract: A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.Type: ApplicationFiled: July 9, 2008Publication date: January 1, 2009Applicant: UBE INDUSTRIES, LTD.Inventors: Ryuichiro KOGURE, Tadahiro YOKOZAWA, Hiroaki YAMAGUCHI, Osamu NAKAYAMA
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Publication number: 20080286538Abstract: A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.Type: ApplicationFiled: January 11, 2005Publication date: November 20, 2008Applicant: Ube Industries, LtdInventors: Tadahiro Yokozawa, Hiroaki Yamaguchi, Keita Banba, Masao Okubo, Sumiko Okubo
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Publication number: 20050162835Abstract: A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.Type: ApplicationFiled: April 24, 2003Publication date: July 28, 2005Applicant: Ube Industires, LTDInventors: Ryuichiro Kogure, Tadahiro Yokozawa, Hiroaki Yamaguchi, Osamu Nakayama
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Patent number: 5403520Abstract: The nonlinear optical device of the present invention comprises a nonlinear optical element comprised of a chiral compound having a third-order nonlinearity. Further, the optical signal processing unit comprises a laser light source, the above-described nonlinear optical device, and a photodetector.Type: GrantFiled: October 27, 1993Date of Patent: April 4, 1995Assignee: Ube Industries, Ltd.Inventors: Hidetomo Ashitaka, Tadahiro Yokozawa, Ryuichi Shimizu, Kazuhiro Morita