Patents by Inventor Tadahito Ito
Tadahito Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240347280Abstract: An electrolytic capacitor 1 includes: a capacitor element 3 in which an anode foil 5 and a cathode foil 7 each having a dielectric oxide film face each other across a separator 6; a body case 2 that houses the capacitor element 3; and a sealing member 4 that seals the body case 2. An electrolyte and a hydrophilic compound are held between the anode foil 5 and the cathode foil 7. A sealing member deterioration preventing agent immiscible with the hydrophilic compound is arranged inside the body case 2.Type: ApplicationFiled: August 23, 2022Publication date: October 17, 2024Applicant: SUN Electronic Industries Corp.Inventors: Hirokazu NISHIKORI, Takashi TAKEZAWA, Masakazu HOSOGI, Tadahito ITO
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Patent number: 8873221Abstract: Provided is a solid electrolytic capacitor having reduced manufacturing man-hour, low leak current, low initial ESR, low ESR after long year use, and long life. The solid electrolytic capacitor includes a anode member made of a valve action metal, a dielectric coating layer formed on a surface of the anode member, a solid electrolytic layer formed on the dielectric coating layer, and a conductive solid layer covering the solid electrolytic layer, in which the conductive solid layer contains silver and nickel, and the weight ratio of nickel to silver is set to 3 to 30%.Type: GrantFiled: July 5, 2012Date of Patent: October 28, 2014Assignee: SUN Electronic Industries Corp.Inventors: Tadahito Ito, Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki
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Publication number: 20130016453Abstract: Provided is a solid electrolytic capacitor having reduced manufacturing man-hour, low leak current, low initial ESR, low ESR after long year use, and long life. The solid electrolytic capacitor includes a anode member made of a valve action metal, a dielectric coating layer formed on a surface of the anode member, a solid electrolytic layer formed on the dielectric coating layer, and a conductive solid layer covering the solid electrolytic layer, in which the conductive solid layer contains silver and nickel, and the weight ratio of nickel to silver is set to 3 to 30%.Type: ApplicationFiled: July 5, 2012Publication date: January 17, 2013Inventors: Tadahito Ito, Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki
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Patent number: 8081420Abstract: On a surface of an anode member 12 having a valve action, a cathode layer 14 is formed, and at a terminal lead-out face 12a at one end of the anode member 12, an anode wire 16 is led out of it; thus a capacitor element 10 is formed. An anode terminal 4 is joined to the anode wire 16. A cathode terminal 5 is joined to the cathode layer 14. A protective layer 2 of resin covers part or all of the capacitor element 10. A packaging member 3 of resin harder than the protective layer 2 covers around the capacitor element 10 including the protective layer 2 and the anode wire 16 to form a package. The protective layer 2 has a larger linear expansion coefficient than the packaging member 3. The mass ratio of the packaging member 3 to the total mass of the packaging member 3 and the protective layer 2 between the terminal lead-out face 12a and the exterior face of the packaging member 3 opposite the terminal lead-out face 12a is 50% or more.Type: GrantFiled: January 21, 2010Date of Patent: December 20, 2011Assignee: SUN Electronic Industries Corp.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Publication number: 20110096467Abstract: On a surface of an anode member 12 having a valve action, a cathode layer 14 is formed, and at a terminal lead-out face 12a at one end of the anode member 12, an anode wire 16 is led out of it; thus a capacitor element 10 is formed. An anode terminal 4 is joined to the anode wire 16. A cathode terminal 5 is joined to the cathode layer 14. A protective layer 2 of resin covers part or all of the capacitor element 10. A packaging member 3 of resin harder than the protective layer 2 covers around the capacitor element 10 including the protective layer 2 and the anode wire 16 to form a package. The protective layer 2 has a larger linear expansion coefficient than the packaging member 3. The mass ratio of the packaging member 3 to the total mass of the packaging member 3 and the protective layer 2 between the terminal lead-out face 12a and the exterior face of the packaging member 3 opposite the terminal lead-out face 12a is 50% or more.Type: ApplicationFiled: January 21, 2010Publication date: April 28, 2011Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Patent number: 7479166Abstract: A method of manufacturing a solid electrolytic capacitor is provided for which an electrolytic polymerization solution can be used semipermanently while preventing a decrease in electrical conductivity of an electrically conductive polymer layer and an increase in ESR of the resultant electrolytic capacitor due to degradation of the electrolytic polymerization solution. The method of manufacturing a solid electrolytic capacitor as provided includes the step (A) of forming a dielectric layer on a surface of an anode element made of a valve metal, the step (B) of forming a cathode layer including an electrically conductive polymer layer on the dielectric layer, and the step (C) of adjusting the pH of a solution that contains a monomer and a dopant agent and that is used in forming the conductive polymer layer, by allowing the solution to contact an ion exchange or ion capture substance.Type: GrantFiled: March 19, 2007Date of Patent: January 20, 2009Assignees: SANYO Electric Co., Ltd., SUN Electronic Industries Corp.Inventor: Tadahito Ito
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Publication number: 20080086859Abstract: A method of manufacturing a solid electrolytic capacitor is provided for which an electrolytic polymerization solution can be used semipermanently while preventing a decrease in electrical conductivity of an electrically conductive polymer layer and an increase in ESR of the resultant electrolytic capacitor due to degradation of the electrolytic polymerization solution. The method of manufacturing a solid electrolytic capacitor as provided includes the step (A) of forming a dielectric layer on a surface of an anode element made of a valve metal, the step (B) of forming a cathode layer including an electrically conductive polymer layer on the dielectric layer, and the step (C) of adjusting the pH of a solution that contains a monomer and a dopant agent and that is used in forming the conductive polymer layer, by allowing the solution to contact an ion exchange or ion capture substance.Type: ApplicationFiled: March 19, 2007Publication date: April 17, 2008Applicants: SANYO ELECTRIC CO., LTD., SUN ELECTRONIC INDUSTRIES CORP.Inventor: Tadahito Ito
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Patent number: 7125764Abstract: A manufacturing method according to the present invention of a solid electrolytic capacitor includes: a step of immersing a anode body on which the dielectrics film layer is formed in a solution that includes from 0.7 to 10% by weight of hydrogen peroxide, from 0.3 to 3% by weight of sulfuric acid and water as a main solvent, followed by, after pulling up, exposing to vapor of pyrrole or a pyrrole derivative, and thereby forming, on the dielectrics film layer, a first conductive polymer layer made of polypyrrole or a polypyrrole derivative; and a step of immersing the anode body on which the dielectrics film layer and the first conductive polymer layer are formed in a solution that includes a polymerizing monomer and a supporting electrolyte to electrolytically polymerize the polymerizing monomer, and thereby forming a second conductive polymer layer on the first conductive polymer layer.Type: GrantFiled: August 12, 2002Date of Patent: October 24, 2006Assignees: Sanyo Electric Co., Ltd., Sun Electronic Industries Corp.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Patent number: 7106575Abstract: A solid electrolytic capacitor has a capacitor element formed by successively forming a dielectric coating, a solid electrolyte layer and a cathode extraction layer on a surface of an anode body, and is characterized in that the capacitor element includes at least one of a polyhydroxy saturated hydrocarbon and phytic acid. With this, a solid electrolytic capacitor can be provided which allows restoring of thermal degradation of a dielectric coating to a practical level.Type: GrantFiled: August 17, 2005Date of Patent: September 12, 2006Assignees: Sanyo Electric Co., Ltd., Sun Electronic Industries Corp.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Patent number: 7092243Abstract: A solid electrolytic capacitor constituted by forming a dielectric coating film, a solid state electrolyte layer, and cathode lead-out layer in order on the surface of an anode body including niobium or an alloy containing niobium as the main component to an end of which an anode lead member is implanted to construct a capacitor element, connecting the anode lead member with an anode terminal and connecting the cathode lead-out layer, at the same time, with a cathode terminal, and being covered and sealed by a sheath resin, in that the sheath resin is formed by injecting and filling liquid silicone resin and heat curing molding the same.Type: GrantFiled: September 7, 2004Date of Patent: August 15, 2006Assignees: Sanyo Electric Co., Ltd., Sun Electronic Industries Corp.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Publication number: 20060044736Abstract: A solid electrolytic capacitor has a capacitor element formed by successively forming a dielectric coating, a solid electrolyte layer and a cathode extraction layer on a surface of an anode body, and is characterized in that the capacitor element includes at least one of a polyhydroxy saturated hydrocarbon and phytic acid. With this, a solid electrolytic capacitor can be provided which allows restoring of thermal degradation of a dielectric coating to a practical level.Type: ApplicationFiled: August 17, 2005Publication date: March 2, 2006Applicants: SANYO ELECTRIC CO., LTD., SUN ELECTRONIC INDUSTRIES CORP.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Publication number: 20050141174Abstract: A solid electrolytic capacitor constituted by forming a dielectric coating film, a solid state electrolyte layer, and cathode lead-out layer in order on the surface of an anode body comprising niobium or an alloy containing niobium as the main component to an end of which an anode lead member is implanted to construct a capacitor element, connecting the anode lead member with an anode terminal and connecting the cathode lead-out layer, at the same time, with a cathode terminal, and being covered and sealed by a sheath resin, in that the sheath resin is formed by injecting and filling liquid silicone resin and heat curing molding the same.Type: ApplicationFiled: September 7, 2004Publication date: June 30, 2005Applicants: SANYO ELECTRIC CO., LTD., SUN ELECTRONIC INDUSTRIES CORP.Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito
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Publication number: 20050030678Abstract: A manufacturing method according to the present invention of a solid electrolytic capacitor includes: a step of immersing a anode body on which the dielectrics film layer is formed in a solution that includes from 0.7 to 10% by weight of hydrogen peroxide, from 0.3 to 3% by weight of sulfuric acid and water as a main solvent, followed by, after pulling up, exposing to vapor of pyrrole or a pyrrole derivative, and thereby forming, on the dielectrics film layer, a first conductive polymer layer made of polypyrrole or a polypyrrole derivative; and a step of immersing the anode body on which the dielectrics film layer and the first conductive polymer layer are formed in a solution that includes a polymerizing monomer and a supporting electrolyte to electrolytically polymerize the polymerizing monomer, and thereby forming a second conductive polymer layer on the first conductive polymer layer.Type: ApplicationFiled: August 12, 2002Publication date: February 10, 2005Inventors: Yutaka Taketani, Yoshiaki Hasaba, Makoto Sakamaki, Tadahito Ito